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Coupling process applied to printed circuit board (PCB) semiconductor package

A semiconductor and coupling technology, which is applied in semiconductor/solid-state device manufacturing, electrical components assembly printed circuit, electrical components, etc., can solve problems such as product reliability decline, reduce quality cost, low cost, and improve reliability level Effect

Inactive Publication Date: 2013-04-24
无锡世一电力机械设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy encapsulation is a complex of multiple materials crossing, there is a bonding interface between epoxy and multiple materials, if the bonding strength of the interface is not enough, it will be delaminated under severe conditions, and the reliability of the product will decrease

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] Before the plastic packaging of PCB products, apply a small amount of adhesion promoter solution evenly to the PCB substrate packaging area, connecting wires, chips, or a certain part of the surface to make it adhere to the surface that needs to be strengthened; the active ingredient of the adhesion promoter is titanic acid Ester coupling agent and silane coupling agent; evaporate the solvent at room temperature, or dry the solvent by baking, and control the coating thickness of the remaining active ingredients at 88nm, and then proceed to the subsequent packaging process. The titanate coupling agent is isopropyl triisostearate titanate, and the silane coupling agent is vinyltrimethoxysilane, wherein isopropyl triisostearate titanate is combined with vinyl The weight percentage of trimethoxysilane is 96:4. The content of isopropyl triisostearate titanate and vinyltrimethoxysilane in the adhesion promoter solution is 0.3%-3%, and the solvent content is 98.7%. It is evenl...

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PUM

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Abstract

The invention discloses a coupling process applied to printed circuit board (PCB) semiconductor package. The coupling process is characterized in that a package area of a PCB substrate is connection with a wire and a chip, adhesion promoter solution is evenly exerted on the partial surface, the adhesion promoter respectively comprises active components of a titanate coupling agent and a silane coupling agent, solution is volatilized to be dried at normal temperature or baked to be dried, the thickness of the residual mixed active component coating is controlled between 10 to 90nm, and then a following package work procedure is carried out. The coupling process can improve combination strength between a plurality of key interfaces in chip package and improves product quality.

Description

technical field [0001] The invention relates to the field of packaging of semiconductor chips, in particular to the technical field of improving packaging quality. Background technique [0002] The silane coupling agent is obtained by addition of silicon chloroform (HSiCl3) and unsaturated olefins with reactive groups under the catalysis of platinum chloride acid, followed by alcoholysis. Silane coupling agent is essentially a class of silanes with organic functional groups, which have reactive groups that can chemically bond with inorganic materials (such as glass, silica sand, metals, etc.) and organic materials (synthetic resins, etc.) Chemically bonded reactive groups. [0003] The titanate coupling agent is a coupling agent developed by the American Kenledge Petrochemical Company in the late 1970s. For thermoplastic polymers and dry fillers, it has a good coupling effect; this type of coupling agent can be represented by the general formula: ROO(4-n)Ti(OX-R'Y)n(n=2,3)...

Claims

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Application Information

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IPC IPC(8): H01L21/56H05K3/30
Inventor 不公告发明人
Owner 无锡世一电力机械设备有限公司