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Surface nanofilm processing method prior to plastic packaging in semiconductor packaging

A processing method and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of weak active group function, increased frame cost, increased packaging cost, etc., to reduce the number of moisture levels, Avoid full inspection and defective products, and prolong the service life

Inactive Publication Date: 2013-11-13
无锡世一电力机械设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The research on the surface roughening treatment of frame materials by lead frame suppliers represented by ASM, because the roughening acts on the surface of the frame, its main effective part is the interface between the frame and epoxy resin, which does not affect the chips and wires. In general, in order to meet the requirements of wire bonding, the frame is usually silver-plated or nickel-plated on the pads of the pins. The effect of roughening on the surface of the coating is often not as good as that of the base material, and the interface here is divided Layers usually play an important role in the life of the product. In addition, the cost increase of the processed frame has a great impact on the overall packaging cost compared with the increase of the ordinary frame.
[0007] Plasma treatment is also a relatively common treatment method. The plasma gas impacts the product before plastic sealing to obtain a clean and activated surface. It is usually more effective for cleaning shallow pollutants or oxidation on the surface, but it produces active radicals that can increase the bonding effect. The group function is relatively weak, and due to the presence of some oil and gas and other pollutants in the air, its effect will decay with the time after treatment, usually not more than 12 hours

Method used

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  • Surface nanofilm processing method prior to plastic packaging in semiconductor packaging
  • Surface nanofilm processing method prior to plastic packaging in semiconductor packaging
  • Surface nanofilm processing method prior to plastic packaging in semiconductor packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1: Implement processing on lead frame products.

[0032] Before the product is plastic-packed, an adhesion promoter is applied to the part that needs to be strengthened. Its main component is a titanate coupling agent, isopropyl triisostearate titanate, and its molecular formula is

[0033]

[0034]Among them, the alkoxy group forms a chemical bond with the metal and the surface of the silicon chip, and the "-O-" in it cross-links with the polymer. The solvent content of the adhesion promoter is 95%-99.9%, and the content of the active coupling agent is 0.1%-5. %, the amount of adhesion promoter is 5ml / m 2 -100ml / m 2 , the thickness of the remaining active nanometer layer after the solvent volatilizes is between 5-100nm. The relationship between the amount of adhesion promoter and the effect is shown in the figure, see Figure 4 and Figure 5 .

[0035] It can be air-dried naturally for 5 minutes to 72 hours, or baked in an oven at 60-150 degrees Cels...

Embodiment 2

[0039] Embodiment 2: Implement processing on lead frame products.

[0040] The solvent content of the adhesion promoter is 97%-99.7%, the active coupling agent content is 0.3%-3%, the main component of the adhesion promoter is silane coupling agent, vinyltrimethoxysilane, and the usage amount is 5ml / m 2 -100ml / m 2 , the thickness of the remaining active nanometer layer after the solvent volatilizes is between 20-60nm. The relationship between the amount of adhesion promoter and the effect is shown in the figure, see Figure 4 and Figure 5 .

[0041] It can be air-dried naturally for 5 minutes to 72 hours, or baked in an oven at 60-150 degrees Celsius for 5 to 60 minutes to form a chemical bond cross-link with the surface of the coated material. After drying, it can be stored for up to 96 hours in an atmospheric environment, and can be stored in a dust-free nitrogen cabinet for up to 1 month.

[0042] The product treated in this embodiment has a moisture level of JEDEC M...

Embodiment 3

[0045] Embodiment 3: Implement processing on PCB products.

[0046] Before the product is plastic-sealed, an adhesion promoter is applied to the part that needs to be strengthened. Its main component is a silane coupling agent, 3-aminopropyl silicon triol, and its molecular formula is

[0047]

[0048] Among them, the "-OH" hydroxyl functional group forms a chemical bond with the surface of the inorganic material (metal, silicon chip), and the "-NH2" amino functional group reacts with the epoxy resin to form a chemical bond. The solvent content of the adhesion promoter is 95%-99.9%. The content of active coupling agent is 0.1-5%, and the amount of adhesion promoter is 5ml / m 2 -100ml / m 2 , the thickness of the remaining active nanometer layer after the solvent volatilizes is between 5-100nm. The relationship between the amount of adhesion promoter and the effect is shown in the figure, see Figure 4 and Figure 5 .

[0049] It can be air-dried naturally for 5 minutes to...

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PUM

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Abstract

The invention discloses a surface nanofilm processing method prior to plastic packaging in semiconductor packaging. The surface nanofilm processing method is characterized in that the surface nanofilm processing method includes the following steps: step a: a small amount of adhesion promoter solution is uniformly applied on the surface of a material to be processed and attached on the surface to be reinforced; step b: the solvent in the adhesion promoter solution is volatilized and air-dried under the normal temperature or dried by way of baking, the thickness of an adhesion promoter active ingredient coating after volatilization is controlled at nanometer-grade thickness, and the adhesion promoter active ingredient coating and the surface to be reinforced on the material to be processed are chemically bonded; step c: the subsequent plastic packaging process is carried out, and the functional group of the other side of the nanometer-grade thickness adhesion promoter active ingredient coating already chemically bonded with the surface of the material to be processed is chemically bonded with epoxy resin used in the plastic packaging process. The surface nanofilm processing method can enhance the bonding strength of a plurality of key interfaces in chip packaging to a certain degree, prevent layering and cracking in the technological process and decrease the moisture level.

Description

technical field [0001] The invention relates to the field of semiconductor chips, in particular to the technical field of semiconductor chip packaging. Background technique [0002] The usual semiconductor packaging process is: chip wafer cutting; chip bonding on the lead frame or substrate; wire bonding to make the chip and external circuit connection conduction; Internal pins of a lead frame or pads on a substrate; split into single pieces and external pin molding. [0003] The main function of epoxy resin encapsulation is to provide mechanical support for internal chips, wires and wire connections, heat dissipation, electrical insulation, and resistance to corrosion caused by moisture or acid and alkali. Epoxy encapsulation is a complex of various materials, and there is a bonding interface between epoxy and various materials. If the bonding strength of the interface is not enough, it will be delaminated under severe conditions, and the reliability of the product will de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56
CPCH01L24/73H01L2224/32225H01L2224/32245H01L2224/48227H01L2224/48247H01L2224/4826H01L2224/73265
Inventor 不公告发明人
Owner 无锡世一电力机械设备有限公司