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ltcc double-layer microstrip antenna for system-in-package

A system-in-package, microstrip antenna technology, used in antennas, resonant antennas, antenna grounding devices, etc., can solve problems such as narrow impedance bandwidth and limit practical applications, and achieve the effect of large bandwidth, diversified functions, and reduced height.

Active Publication Date: 2015-08-05
XIDIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the common single-layer microstrip antenna also has its inherent disadvantages, that is, the impedance bandwidth is narrow, generally only a few percent, which limits its practical application.

Method used

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  • ltcc double-layer microstrip antenna for system-in-package
  • ltcc double-layer microstrip antenna for system-in-package
  • ltcc double-layer microstrip antenna for system-in-package

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Embodiment 1

[0027] refer to figure 1 , the system of the present invention includes eight layers, the first layer is the antenna coating 1, the second layer is the upper radiation unit 2, the third layer is the middle interlayer 3, the fourth layer is the lower radiation unit 4, and the fifth layer is the antenna substrate layer 5. The sixth layer is the internal ground plane 6 , the seventh layer is the package body 7 , and the eighth layer is the external ground plane 8 . Among them: the first layer of antenna coating 1 is made of LTCC dielectric material with a thickness of H=0.79mm and a dielectric constant of 7.8, and the third interlayer 3 is made of an LTCC dielectric material with a thickness of H=3.3mm and a dielectric constant of 7.8 The fifth antenna substrate layer 5 is made of LTCC dielectric material with a thickness of H=1.03 mm and a dielectric constant of 7.8. The lower surface of the fifth layer is coated with silver or gold as the internal grounding metal layer 6; the ...

Embodiment 2

[0033] General structure is identical with embodiment 1, and its different parameters are as follows:

[0034] The thickness of the antenna coating 1 is H1 = 0.83 mm.

[0035] Antenna substrate 5 thickness H3=1.32mm

[0036]The upper radiating unit of the square sheet and the lower radiating unit of the square sheet adopt a coaxial design, and the central axes are on the same straight line, that is, the distance between the upper radiating unit 2 and the boundary of the middle interlayer 3 is L1=13.2mm, and the distance between the lower radiating unit 4 and the boundary of the middle interlayer 3 It is L2=13.9mm.

[0037] The thickness W1 of each side wall of the package body is 2 mm, and the distance between the through holes is 0.8 mm.

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Abstract

The invention discloses a lower temperature co-fired ceramic (LTCC) double-layer microstrip antenna used for system-in-package. The LTCC double-layer microstrip antenna used for the system-in-package comprises an antenna coating (1), an upper layer radiating element (2), a middle interlayer (3), a lower layer radiating element (4), an antenna substrate layer (5), an interior earth plate (6), a package (7) and an exterior earth plate (8). Compared with the prior art, the LTCC double-layer microstrip antenna used for the system-in-package has the advantages that three dimension multi-chip module (3D-MCM) technology is adopted, a cavity is formed in the interior of the package, integrated circuit (IC) bare chips can be inlaid in the cavity, and therefore the size of a system is enabled to be smaller, and functions are diversified; all earth design is adopted for the exterior earth plate, and therefore the antenna is free of spatial use limitations, and the antenna is unnecessary to be placed on a corner of a printed circuit board (PCB); and a double-layer microstrip line is adopted as the radiating elements, and therefore the antenna is enabled to have a small lateral dimension, and meanwhile a large bandwidth of 2.35GHz-2.55GHz is obtained.

Description

technical field [0001] The invention belongs to the technical field of microwave and millimeter wave communication, and relates to antenna technology and system-level packaging technology, in particular to a stacked microstrip antenna technology with coaxial feeding. Background technique [0002] With the popularization of modern indoor mobile communication equipment, antenna devices with small volume and light weight are required in many applications. Microstrip antennas have become the focus of attention due to their thin profile, light weight, conformability to carriers, and easy integration with active devices, and are widely used in Bluetooth, wireless USB, WIFI and other fields. But the ordinary single-layer microstrip antenna also has its inherent disadvantages, that is, the impedance bandwidth is narrow, generally only a few percent, which limits its practical application. [0003] In the past few years, researchers have continued to innovate in order to keep the an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H01Q1/48H01Q9/04H01Q13/08
Inventor 董刚季强李龙杨银堂
Owner XIDIAN UNIV
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