Preparation method of low-percolation graphene/macromolecule electromagnetism shielding material

An electromagnetic shielding material, graphene technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of not checking graphene/polymer conductive composite materials, etc., to avoid the use of chemical reducing agents, The effect of low production cost and simple preparation process

Inactive Publication Date: 2013-05-08
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

There is also no patent literature on the preparation of graphene / polymer conductive composite materials by one-step in-situ thermal reduction

Method used

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  • Preparation method of low-percolation graphene/macromolecule electromagnetism shielding material
  • Preparation method of low-percolation graphene/macromolecule electromagnetism shielding material
  • Preparation method of low-percolation graphene/macromolecule electromagnetism shielding material

Examples

Experimental program
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Embodiment 1

[0029] The main raw materials are composed of the following weight percentages: UHMWPE99.7%; GONS0.3%.

[0030] The process steps adopt:

[0031] (1) raw material drying: the prepared GONS is dried in a vacuum oven at a constant temperature of 60°C until the moisture weight content is lower than 0.01%;

[0032] (2) Preparation of GONS / UHMWPE conductive particles: the dried GONS and deionized water in step (1) were formulated into a GONS suspension at a mass ratio of 1:200, and then uniformly dispersed by ultrasonic and mechanical stirring for 60 minutes; the UHMWPE particles were poured Put into the dispersed GONS suspension, mix it uniformly by ultrasonic stirring for 30 minutes, then remove the solvent by distillation under reduced pressure at 60°C; finally dry in an oven below 60°C until the moisture content is low at 0.01%.

[0033] (3) High-temperature compression molding: the GONS / UHMWPE conductive composite particles prepared in step (2) were pre-pressed at room tempe...

Embodiment 2

[0035] Others are the same as in Example 1, and the ratio of raw materials is UHMWPE99.5%; GONS0.5%. In step (1), the GONS oven temperature is 59°C.

[0036] When preparing GONS / UHMWPE composite particles in step (2), the mass ratio of GONS and deionized water is 1:100.

Embodiment 3

[0038] Others are the same as in Example 1, and the ratio of raw materials is UHMWPE99%; GONS1%. In step (1), the GONS oven temperature is 58°C.

[0039] When (2) step prepares GONS / UHMWPE composite particle, the mass ratio of GONS and deionized water is 1: 80;

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Abstract

The invention relates to a preparation method of a low-percolation graphene/macromolecule electromagnetism shielding material. The composite material comprises the following main raw materials by weight percent: 94-99.7wt% of ultra-high molecular weight polyethylene (UHMWPE) and 0.3-6wt% of graphene oxide GONS. The preparation process comprises the following steps: (1) drying the raw materials; (2) preparing GONS/UHMWPE conductive particles; and (3) pressing and forming at high temperatures. According to the invention, the graphene oxide is reduced in situ at high temperatures in a hot pressing preparation process, so that the agglomeration of the graphene oxide in a chemical reduction process is avoided, the composite material has lower conductive percolation value, higher conductivity and higher electromagnetism shielding performance; and the preparation process is simple and low in production cost, the process is easy to master and mass production is easy to achieve.

Description

technical field [0001] The invention relates to the field of conductive polymer composite materials, in particular to a method for preparing a low percolation graphene (hereinafter referred to as GNS) / ultra-high molecular weight polyethylene (hereinafter referred to as UHMWPE) polymer electromagnetic shielding material. Background technique [0002] Compared with the conductive polymer materials prepared by the conventional melting method, the isolated structure polymer conductive composite material can show excellent electrical properties under the extremely low conductive particle filler (H.Pang, et al.Mater.Lett.2012, 79 : 96-99.). The reason is that in the isolated structure network, the conductive particles are selectively distributed among the polymer particle interfaces instead of randomly distributed inside the polymer matrix. Therefore, conductive polymer composite materials with isolation structure have a wide range of applications in the fields of antistatic, sel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/06C08K3/04H01B1/24B29C43/58
Inventor 李忠明庞欢陈晨雷军钟淦基
Owner SICHUAN UNIV
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