Method and device for improving wettability of brazing filler metal and method and device thereof for detection experiments

Abstract

The invention relates to a method and a device for improving wettability of brazing filler metal and a method and a device thereof for detection experiments. The method for improving wettability of the brazing filler metal includes the following steps: placing a test piece between an upper electrode plate and a lower electrode plate of a static field forming set output voltage, utilizing an ultrasonic transfer rod in transmission connection with an ultrasonic vibration source with set frequency and vibrating to stretch into the static field and utilizing a vibration press head fixedly connected onto the ultrasonic transfer rod to exert ultrasonic load on the test piece. By means of the method, ultrasonic vibration load and static field assistance can both act on the brazing filler metal and a bus material, wettability of the brazing filler metal can be greatly improved, and the shortcoming in the prior art of limit of single ultrasonic vibration application or single static field application in improvement of the wettability of the brazing filler material is overcome. The method and the device for improving wettability of brazing filler metal and the method and the device for detection experiments expand the brazing technical research with less brazing flux even free of brazing flux, can be used for test experiments of the brazing filler metal performance and can also be applied to industrial brazing filler metal production.

Description

technical field [0001] The invention relates to a related method and device for improving the wettability of solder. Background technique [0002] Wettability is an important property of solder, and good wettability is the prerequisite for obtaining brazing joints with high reliability. The wettability of solder is related to the spread of liquid solder on the surface of the base metal, the mass transfer behavior of the material interface, and the interfacial tension of gas-liquid and solid-liquid. At present, the method to improve the wettability of solder is mainly to use flux to remove the oxide film on the surface of the base metal through chemical reaction, and reduce the surface tension of solid and liquid to protect the liquid solder from oxidation. The above method will have adverse effects on brazing joints or joints during service. In addition, in the prior art, there are also methods and devices for improving the wettability of solder by applying external energy...

AI Technical Summary

Problems solved by technology

[0008] The method for improving the wettability of the solder in the present invention can make the solder and the base metal act together with the assistance of the ultrasonic vibration load and the electrostatic field, thereby greatly improving the wettability of the solder, and overcoming the single application of ultrasonic vibration in the prior art Or the limitations of single application of electrostatic field in improving the wettability of solder (unable to realize the joint action of vibration load and electrostatic field, poor temperature uniformity of heating environment for single application of ultrasonic vibration device, single type of electrostatic field power supply of single application of electrostatic field device, And both have shortcomings such as poor secondary development of experimental devices)

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