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2,6-bis(2,4-diamidophenoxy)toluene high-temperature-resistant epoxy adhesive and preparation method thereof

A technology of diaminophenoxy and epoxy adhesives, which is applied in the direction of adhesives, epoxy resin adhesives, polymer adhesive additives, etc., can solve the problem of high price, unfavorable large-scale promotion and application, and the cost of polyetherimide resin. Advanced problems, to achieve the effect of convenient operation, good application prospects, and strong hydrophobicity

Inactive Publication Date: 2014-12-10
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • 2,6-bis(2,4-diamidophenoxy)toluene high-temperature-resistant epoxy adhesive and preparation method thereof
  • 2,6-bis(2,4-diamidophenoxy)toluene high-temperature-resistant epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Preparation of component A

[0045] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 16.8 g (0.05 mol) of 2,6-bis Put (2,4-diaminophenoxy)toluene into a reaction kettle, heat up to 50°C, and stir for 2 hours to obtain 116.8 g of a homogeneous and transparent copolymer, which is designated as A1.

[0046] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 13.4 g (0.04 mol) of 2,6-bis Put (2,4-diaminophenoxy)toluene into a reaction kettle, heat up to 90° C., and stir for 0.5 hours to obtain 113.4 g of a homogeneous and transparent copolymer, designated as A2.

[0047] Mix 100 g of 4,5-epoxycyclohexane-1,2-dicarboxylate diglycidyl epoxy resin (epoxy value 0.85) with 15.8 g (0.047 mol) of 2,6-bis(2,4- Diaminophenoxy)toluene was put into a reaction kettle, heated to 60° C., stirred and reacted for 2 hours to obtain 115.8 grams of a homogeneous and transparent copolymer, whic...

Embodiment 2

[0051] Preparation of Component B

[0052] At room temperature, add 33.6 grams (0.1 moles) of 2,6-bis(2,4-diaminophenoxy)toluene and 808 grams of N,N-dimethylacetamide into the reaction kettle, stir and dissolve completely, then add 104 g (0.2 mol) 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and 64.4 g (0.2 mol) 3,3',4,4'-tetracarboxy Benzophenone dianhydride was stirred and reacted for 0.5 hours to obtain 1010 grams of homogeneous transparent solution. Add 160 grams of toluene and heat up to reflux for reflux water separation reaction. The temperature was 100°C and the reaction time was 2 hours. After the reaction was completed , to separate part of the organic solvent so that its solid content is in the range of 15%-30%, which is denoted as B1.

[0053] At room temperature, 33.6 grams (0.1 moles) of 2,6-bis(2,4-diaminophenoxy)toluene and 117 grams of N,N-dimethylacetamide and 500 grams of N-methyl-2-pyrrolidone Add to the reaction kettle, stir and dissolve c...

Embodiment 3

[0056] Preparation of 2,6-bis(2,4-diaminophenoxy)toluene type high temperature resistant epoxy adhesive

[0057] At room temperature, stir and mix components A and B according to the mass ratio of 1:1-2 to obtain a series of 2,6-bis(2,4-diaminophenoxy)toluene type high temperature resistant epoxy adhesives , recorded as HTEA-p, p is a natural number, and the specific formula is shown in Table 1.

[0058] Table 12, 6-bis(2,4-diaminophenoxy) toluene type high temperature resistant epoxy adhesive formula table unit: gram

[0059] Component

[0060] HTEA-7

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Abstract

The invention relates to a 2,6-bis(2,4-diamidophenoxy)toluene high-temperature-resistant epoxy adhesive and a preparation method thereof. The 2,6-bis(2,4-diamidophenoxy)toluene high-temperature-resistant epoxy adhesive is composed of a component A and a component B in a mass ratio of 1:(1-2), wherein the component A is a copolymer prepared by reacting 2,6-bis(2,4-diamido phenoxy)toluene and epoxy resin; and the component B is a homogeneous-phase transparent solution with the solid content of 15-30%, which is prepared by reacting 2,6-bis(2,4-diamidophenoxy)toluene and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

Description

technical field [0001] The invention belongs to the field of epoxy resin adhesives and preparation thereof, in particular to a 2,6-bis(2,4-diaminophenoxy)toluene type high temperature resistant epoxy adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) Good...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C08G73/10
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV