Ceramic base copper clad laminate and production method thereof

Abstract

The invention discloses a ceramic base copper clad laminate and a production method thereof. The ceramic base copper clad laminate comprises a ceramic substrate. A titanium layer, a nickel layer and a copper layer are sequentially arranged on the ceramic substrate. The titanium layer is attached to the ceramic substrate, the nickel layer is attached to the titanium layer, the copper layer is attached to the nickel layer, and a copper thickened layer is further electroplated on the copper layer. The production method of the ceramic base copper clad laminate includes the steps of cleaning, plasma treatments, vacuum splattering, thickened copper plating and the like. A good adhesive force exists between the titanium layer and the ceramic substrate, a good adhesive force exists between the nickel layer and the titanium layer, and a good adhesive force exists between the nickel layer and the copper layer. Therefore, the copper layer can be connected with the ceramic substrate firmly so as to facilitate follow-up treatments. For the ceramic base copper clad laminate, different circuits can be designed by customers according to different circuit requirements, and only with one additional etching process can a ceramic printed circuit board (PCB) be obtained. The ceramic base copper clad laminate meets the requirements of customers for PCBs with different circuit designs, facilitates mass production, and lowers production cost.

Description

technical field [0001] The invention relates to the technical field of circuit boards and preparation methods thereof, in particular to an aluminum oxide or aluminum nitride ceramic copper-clad board and a preparation method thereof. Background technique [0002] Ceramic materials have the characteristics of high thermal conductivity, low dielectric constant, thermal expansion coefficient similar to chips, high heat resistance and electrical insulation. Ceramic materials have been widely used in electronic products and electronic equipment. In the prior art, the following processes are mostly used on ceramic substrates: cleaning - vacuum sputtering - electroless copper deposition - circuit wiring - dry film application, exposure, development - electroplating copper thickening - chemical etching, etc. In the prior art, in the vacuum sputtering process, a layer of titanium is first sputtered and then a layer of copper is sputtered. However, in practical applications, because t...

AI Technical Summary

Problems solved by technology

In the prior art, the following processes are mostly used on ceramic substrates: cleaning - vacuum sputtering - electroless copper deposition - circuit wiring - dry film application, exposure, development - electroplating copper thickening - chemical etching, etc. In the prior art, in the vacuum sputtering process, a layer of titanium is first sputtered and then a layer of copper is sputtered. However, in practical applications, because titanium metal is particularly easy to passivate, sputtering The copper plating layer is not dense enough, and it is difficult to ensure that the titanium layer will not be oxidized and passivated during subsequent processing.

Therefore, the adhesion between the thickened copper plating layer and the titanium layer is difficult to guarantee, and it is easy to cause the anti-peeling strength to fail to meet the requirements

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