High-conductivity aluminum alloy plate extrusion forming device and technology

An aluminum alloy plate, extrusion forming technology, applied in the direction of metal extrusion dies, etc., can solve problems such as cracks, achieve the effects of improving stress conditions, increasing deformation texture, and increasing yield

Inactive Publication Date: 2013-06-12
安徽皖北铝基新材料技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the processing technology of aluminum alloy plates with conductivity greater than 57%IACS has not been reported, which limits the application of aluminum alloy plates with

Method used

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  • High-conductivity aluminum alloy plate extrusion forming device and technology
  • High-conductivity aluminum alloy plate extrusion forming device and technology
  • High-conductivity aluminum alloy plate extrusion forming device and technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Using 6061 / 6063 aluminum alloy as the matrix to prepare such as figure 1 The conductivity shown is greater than 57% IACS aluminum alloy sheet.

[0022] First, melt the 6061 / 6063 aluminum alloy ingot with a melting furnace suitable for melting aluminum-silicon alloy, put the dried aluminum alloy ingot into the crucible with tongs, and put the crucible into the melting furnace. When heated to 690°C, an Al-B alloy with a B content of 3% is put in, wherein the B element content is 0.05% (mass percentage) of the total alloy content. Press the Al-B alloy into the molten aluminum. After the molten aluminum is completely melted, stir fully to make the ingredients uniform. Let stand for 45 minutes to ensure that impurity elements are removed by precipitation. When the temperature of the molten aluminum reaches 710°C, remove the smelting scum in the crucible, and add Al-Ti-B alloy (the main component is AlTi5B1) as a refiner, and the amount added is 0.1%-0.3% of the aluminum ...

Embodiment 2

[0024] Using 6061 / 6063 aluminum alloy as the matrix to prepare such as figure 1 The conductivity shown is greater than 57% IACS aluminum alloy sheet.

[0025] First, melt the 6061 / 6063 aluminum alloy ingot with a melting furnace suitable for melting aluminum-silicon alloy, put the dried aluminum alloy ingot into the crucible with tongs, and put the crucible into the melting furnace. When heated to 700°C, an Al-B alloy with a B content of 3% is put in, wherein the B element content is 0.06% (mass percentage) of the total alloy content. Press the Al-B alloy into the molten aluminum. After the molten aluminum is completely melted, stir fully to make the ingredients uniform. Let stand for 60 minutes to ensure that impurity elements are removed by precipitation. When the temperature of the molten aluminum reaches 720°C, remove the smelting scum in the crucible, and add Al-Ti-B alloy (the main component is AlTi5B1) as a refiner, and the amount added is 0.1%-0.3% of the aluminum ...

Embodiment 3

[0027] Using 6061 / 6063 aluminum alloy as the matrix to prepare such as figure 1 The conductivity shown is greater than 57% IACS aluminum alloy sheet.

[0028] First, melt the 6061 / 6063 aluminum alloy ingot with a melting furnace suitable for melting aluminum-silicon alloy, put the dried aluminum alloy ingot into the crucible with tongs, and put the crucible into the melting furnace. When heated to 720°C, an Al-B alloy with a B content of 3% is put in, wherein the B element content is 0.08% (mass percentage) of the total alloy content. Press the Al-B alloy into the molten aluminum. After the molten aluminum is completely melted, stir fully to make the ingredients uniform. Let stand for 75 minutes to ensure that impurity elements are removed by precipitation. When the temperature of the molten aluminum reaches 730°C, remove the smelting scum in the crucible, and add Al-Ti-B alloy (the main component is AlTi5B1) as a refiner, and the amount added is 0.1%-0.3% of the aluminum al...

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Abstract

The invention provides a high-conductivity aluminum alloy plate extrusion forming device and technology. The forming device is an extrusion mold which comprises an extrusion rod, an extrusion cylinder, a flow guide mold and a forming mold; an extrusion groove of the flow guide mold is designed to be inverted conical; and the shapes of the extrusion groove of the forming mold and a forming element are keep to be consistent. The forming technology comprises the steps of preparing aluminum alloy blanks, preheating a mold, spraying graphite, and extruding and forming an aluminum alloy plate. Metal materials provided by the invention are not formed once in the forming process, and are subjected performing and final forming; stress produced in the forming process is reduced; the deformation texture in the aluminum alloy plate is increased; and the conductivity performance and heat conduction capability of products are improved greatly.

Description

technical field [0001] The invention relates to an extrusion forming process of an IACS aluminum alloy plate with high electrical conductivity, in particular, the electrical conductivity is greater than 57%, and belongs to the field of extrusion forming. Background technique [0002] With the continuous development of my country's national economy, environmental and energy issues have become increasingly prominent, and energy conservation and consumption reduction have become the urgent needs and primary tasks of my country's current economic development. Lightweight is an important aspect of saving energy and reducing environmental pollution. In the field of material processing, the development of the aluminum industry, which is a typical representative of lightweight, conforms to the trend of world economic development, which reduces energy consumption, improves environmental protection, reduces costs and improves economic benefits. Wide range of applications. The key ma...

Claims

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Application Information

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IPC IPC(8): B21C23/21B21C25/02C22F1/04
Inventor 王开坤付金龙王玉知
Owner 安徽皖北铝基新材料技术研究院有限公司
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