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Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device

An anisotropic, conductive film technology that is applied in the fields of resin compositions and films, anisotropic conductive films, and semiconductor devices to achieve excellent adhesion, improve fluidity, and prevent the reduction of electrical connection reliability

Active Publication Date: 2013-06-19
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, when a small amount, such as 10 to 30 wt%, is added to the film-forming polymer resin, the film becomes quite soft, causing processability problems

Method used

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  • Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device
  • Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device
  • Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device

Examples

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Embodiment 1 to 5

[0107] Examples 1 to 5: Preparation of anisotropic conductive film

[0108] Add urethane resin, EVA copolymer, tricyclodecane dimethanol diacrylate, organic particles, organic peroxide, conductive particles and toluene as solvent according to the composition listed in Table 1 in the planetary mixer, dissolve and After dispersion, the solution was applied onto a release-treated PET film and dried by heating to 60° C. for 5 minutes in a forced convection oven to evaporate the solvent, thereby preparing an anisotropic conductive film having a thickness of 35 μm.

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Abstract

The invention discloses an anisotropic conductive film composition comprising a binding agent containing at least one of polyester type polyurethane resin, polyurethane acrylate resin, and carbamic acid ester resin; ethylene-acetic acid vinyl ester copolymer; materials capable of free radical polymerization containing tricyclodecane dimethanol diacrylate or tricyclodecane dimethanol dimethyl methacrylate; and organic particles. To be specific, the invention relates to a resin composition used for connection of the circuit and a film, which is provided with an extension rate in a range from 10 to 100% after the solidification and has no obvious retraction and expansion in the connection structure. The reliability of the electric connection under the high temperature and high humidity condition can be reduced. The invention also provides a semiconductor device containing the above mentioned anisotropic conductive film.

Description

technical field [0001] The present invention relates to an anisotropic conductive film composition, an anisotropic conductive film produced from the composition, and a semiconductor device. More specifically, the present invention relates to an anisotropic conductive film composition comprising: a polyester urethane resin, a urethane acrylate resin, and a urethane resin other than the polyester urethane resin and the urethane acrylate resin A binder of at least one of: an ethylene-vinyl acetate copolymer; a radically polymerizable material comprising tricyclodecane dimethanol diacrylate or tricyclodecane dimethanol dimethacrylate and organic particles. In particular, the present invention relates to a resin composition and a film for connecting circuits, which have an elongation of 10% to 100% after curing without significant shrinkage and expansion in the connection structure, thereby preventing electrical discharge under high temperature and high humidity. The reliability o...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J175/14C09J9/02H01L23/488
CPCC08J5/18C09J9/02H01B1/20H01B5/16H05K3/323
Inventor 徐贤柱申炅勋申颍株林佑俊金奎峰
Owner KUKDO ADVANCED MATERIALS CO LTD
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