Synthesis and application of resin for copper-clad plate

Abstract

The invention discloses synthesis of a resin for a copper-clad plate. The method comprises the following steps: mixing 80-100 mass parts of phenol, 40-80 mass parts of formaldehyde and 20-40 mass parts of paraformaldehyde, adding 2-8 parts of triethylamine, 1-5 parts of sodium hydroxide or 4-10 parts of ammonia water to serve as a catalyst, uniformly stirring, heating to the temperature of 80-85 DEG C, reacting for 80-150 minutes, and finally adding 20-60 parts of methanol, alcohol or acetone to serve as a solvent, and mixing to prepare the resin. During application, the resin serves as disposable glue and is dipped into wood pulp paper for a CEM-1 copper-clad plate core base material or a paper substrate, so that the resin content is controlled to be 7-20 percent; and the resin is dipped in glue again to generate a CEM-1 copper-clad plate core or paper substrate adhesion piece, the CEM-1 copper-clad plate core or paper substrate adhesion piece is matched with a CEM-1 copper-clad plate surface adhesion piece to prepare a CEM-1 copper-clad plate or is combined with multiple adhesion pieces, to prepare the paper substrate. The operation process is simple during application, the manufactured copper-clad plate is high in thermal stress, and the other performances are equivalent to basic performances of common like copper-clad plates.

Description

technical field [0001] The invention relates to the technical field of manufacturing and processing electronic material copper-clad laminates, in particular to the synthesis and application of a resin for copper-clad laminates. Background technique [0002] The wood pulp paper used for the core material of CEM-1 copper-clad laminates and paper substrates is generally produced by dipping twice. The first dipping is generally made of melamine resin or other common phenolic water-soluble small molecule resins. The thermal stress of CEM-1 copper clad laminates and paper substrates produced in this way is not high, and the produced copper clad laminates are hard and poor in processability; if melamine resin is used, although the resin contains nitrogen, it can enhance the flame retardancy of the plates, but The resin has poor storage and handling properties, making the board harder, brittle and less workable. Contents of the invention [0003] In order to overcome the shortcom...

AI Technical Summary

Problems solved by technology

The thermal stress of CEM-1 copper clad laminates and paper substrates produced in this way is not high, and the produced copper clad laminates are hard and poor in processability; if melamine resin is used, although the resin contains nitrogen, it can enhance the flame retardancy of the plates, but The resin has poor storage and handling properties, making the board harder, brittle and less workable

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