A photolithography machine using a mirrored silicon wafer stage
A technology for a silicon wafer stage and a lithography machine, applied in the field of lithography, can solve the problems of loss of precision and complex mechanism, and achieve the effects of improved reliability, simplified motion mechanism, and simplified structure of the whole machine.
Active Publication Date: 2015-11-18
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology
The silicon wafer table and the immersion maintenance table need to be docked with high precision and move synchronously during the handover process. The mechanism is complex, and the position information of the silicon wafer needs to be handed over during the docking process of the two machines, which is easy to lose accuracy.
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[0027] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0028] As shown in FIG. 1( a ) and ( b ), the lithography machine proposed by the present invention is configured with a mirrored silicon wafer stage, where two silicon wafers 101 , 102 are symmetrically arranged on the mirrored silicon wafer stage 100 . The measuring sensor position references 200 and 201, 202 are respectively arranged in the middle and the left and right sides of the two silicon wafers. The center points of the position measuring references and the silicon wafers are on a straight line and the distances between adjacent points are equal. These three position references can provide horizontal and vertical six-degree-of-freedom reference positions, and these reference positions can be captured by position sensors inside the lithography machine.
[0029] The measurement system configuration adapted to the silicon wafer stage pr...
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Abstract
The invention provides a lithography machine using mirror image wafer stage. The machine comprises a lighting system, a reticle stage, a projection objective, a wafer stage, a wafer transfer system and a position measurement system. The machine is characterized in that: a first wafer and a second wafer are arranged on the wafer stage by taking the center of wafer stage as symmetric point left and right; a first position measuring basis, a second measuring basis and a third measuring basis are arranged along the direction of the wafer stage on the silicon wafer stage center and external sides of the wafers, for providing horizontal and vertical reference position with six degree of freedom; the position measuring bases and the central point of the wafer are in a same line, and the adjacent points have an equal spacing; the position measurement system comprises a first position measurement system and a second position measurement system, which are symmetrically arranged at both sides of the projection objective; a distance from the measurement axis of each position measurement system to an optical axis of the projection objective is equal to the spacing between two adjacent position bases on the wafer stage; the measurement axes and the optical axis of the projection objective are in a same plane; and a connecting line of the measuring bases on the wafer stage is parallel to the plane.
Description
technical field [0001] The present invention relates to the field of lithography technology, in particular to a lithography machine using a mirrored silicon wafer stage, a silicon wafer measurement system configuration and a lithography exposure process based on the configuration of the silicon wafer stage, and the lithography machine in liquid immersion application under exposure conditions. Background technique [0002] In the manufacturing process of integrated circuit chips, the lithography machine is responsible for transferring the circuit layout onto the silicon substrate by projection exposure to form the required functional devices and layout connections. As the most critical link in the manufacture of integrated circuit chips, the imaging and overlay performance of the lithography machine directly determines the final electrical performance of the integrated circuit chip, and the production efficiency of the lithography machine determines the profitability of the c...
Claims
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IPC IPC(8): G03F7/20
Inventor 杨志勇
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD