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A method for improving the brightness and hardness of a nitride hard coating on the surface of a substrate

A hard coating, substrate surface technology, applied in metal material coating process, coating, ion implantation plating and other directions, can solve the problem of inability to take into account high brightness, color and high hardness, achieve good application prospects, improve Color and hardness, the effect of increasing hardness and gloss

Active Publication Date: 2015-10-14
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical purpose of the present invention is to provide a method to improve the quality of the nitride hard coating on the surface of the substrate at the same time, aiming at the problem that the hard nitride coating on the surface of the substrate still cannot be balanced with high brightness and high hardness at the same time. Method of layer brightness and hardness

Method used

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  • A method for improving the brightness and hardness of a nitride hard coating on the surface of a substrate
  • A method for improving the brightness and hardness of a nitride hard coating on the surface of a substrate
  • A method for improving the brightness and hardness of a nitride hard coating on the surface of a substrate

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Part of the sample is taken out from the silicon wafer sample and the glass sample obtained in the above-mentioned comparative example 1 to deposit a CrN coating and carry out aftertreatment, that is, these samples are placed in the plasma equipment of argon gas, so that the plasma of argon gas is CrN coating is etched. The treatment conditions are as follows: working current 0.2A, voltage 1300V, working air pressure 2.3mtorr, treatment time is 5 minutes, 10 minutes, 15 minutes, 20 minutes, 30 minutes respectively, and there is no heating during the treatment.

[0029] After plasma etching of argon gas for 5 minutes, 10 minutes, 15 minutes, 20 minutes and 30 minutes, the SEM surface topography of the CrN coating on the surface of the silicon wafer is as follows figure 1 Shown in (b)-(f). From figure 1 It can be seen that the CrN coating structure after argon plasma etching is denser than that of the CrN coating without argon plasma etching (a).

[0030] figure 2 It...

Embodiment 2

[0038] Part of the sample is taken out from the silicon wafer sample and the glass sample obtained in the above Comparative Example 2 for post-processing, that is, these samples are placed in the plasma equipment of argon gas, so that the plasma of argon gas is ZrN coating is etched. The treatment conditions are as follows: working current 0.3A, voltage 1500V, working air pressure 2.7mtorr, treatment time is 15 minutes respectively, no heating during treatment.

[0039] The ZrN coating on the surface of the silicon wafer obtained in Comparative Example 2 and the implementation 2 is tested as follows:

[0040] (1) Observation of SEM surface topography

[0041]The results show that, similar to the comparative results in Comparative Example 1 and Example 1, the ZrN coating after the plasma etching of argon is compared with the ZrN coating topography without the plasma etching of argon The structure is denser;

[0042] (2) XRD pattern of ZrN coating

[0043] The results show t...

Embodiment 3

[0052] The surface deposition (Cr, Al) N coated silicon wafer sample and the glass sample obtained in the above-mentioned comparative example 2 take out some samples and carry out aftertreatment, be about to these samples are placed in the plasma equipment of argon gas, make argon gas plasma to etch the ZrN coating. The treatment conditions are as follows: working current 0.1A, voltage 1500V, working air pressure 2.1mtorr, treatment time is 5 minutes respectively, no heating during treatment.

[0053] The ZrN coating on the surface of the silicon wafer obtained in Comparative Example 2 and the implementation 2 is tested as follows:

[0054] (1) Observation of SEM surface topography

[0055] The results show that, similar to the comparative results in Comparative Example 1 and Example 1, the ZrN coating after the plasma etching of argon is compared with the ZrN coating topography without the plasma etching of argon The structure is denser;

[0056] (2) XRD pattern of CrN coa...

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Abstract

The invention provides a method for improving brightness and hardness of a nitride hard coating on the surface of a substrate. According to the method, after deposition of the nitride hard coating on the surface of the substrate, inertial plasma is used for etching of the surface of the nitride hard coating; since the inertial plasma does not lead to transformation of the phase structure of the coating, original chemical performances of the coating are maintained; and since high energy of the inertial plasma improves density of the coating, the brightness of the coating is improved at the same time. Experiments confirm that the method provided by the invention is an effective method for improvement of brightness and hardness of the nitride hard coating on the surface of the substrate and has good application prospects.

Description

technical field [0001] The invention belongs to the technical field of hard wear-resistant decorative coatings on the surface of substrates, in particular to a method for improving the brightness and hardness of nitride hard coatings on the surface of substrates. Background technique [0002] With the development of society, more and more substrate surfaces require hard wear-resistant coatings for decoration and protection, such as commonly used bathroom hardware, door and window accessories, and electronic devices that are currently widely used, such as PDAs, mobile phones, Digital cameras, etc., so the performance requirements for hard wear-resistant coatings are also getting higher and higher. [0003] Among the many PVD (Physical Vapor Deposition) surface protective coatings, nitrides are often selected to improve the surface properties of substrates due to their advantages such as high melting point, high hardness, good thermal stability, good corrosion resistance and o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/06C23C14/58
Inventor 汪爱英孙丽丽张栋陈仁德柯培玲
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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