Heat conduction diffusion sheet and preparation method thereof

Abstract

The invention discloses a heat conduction diffusion sheet which comprises a heat conduction pressure-sensitive rubber layer (1), a metal heat diffusion layer (2), a heat conduction diffusion layer (3), a foaming heat insulation layer (4) and a polymer heat isolation layer (5) which are stacked in sequence, and the invention further discloses a preparation method of the heat conduction diffusion sheet. As the heat conduction pressure-sensitive rubber layer can be directly adhered on a heating unit, the contact heat resistance value between the heat conduction diffusion sheet and the heating unit is reduced, and the heat conducted from the heating unit to the metal heat diffusion layer and the heat conduction diffusion layer is accelerated; and moreover, as the foaming heat insulation layer is adopted, the heat diffusivity of the heat conduction diffusion sheet is enhanced. The heat conduction diffusion sheet disclosed by the invention has the advantages of simple structure, convenience and quickness in preparation, and obvious heat conduction diffusion effect.

Description

technical field [0001] The invention relates to the field of heat dissipation materials for electronic components, in particular to a novel high thermal conductivity heat conduction diffusion sheet replacing traditional graphite sheets and a preparation method thereof. The thermal diffusion composite material can be used for the diffusion of heat generated by heating components such as central processing unit (CPU) or integrated circuit (IC) or LED, so as to avoid damage caused by heat concentration. Background technique [0002] Existing thermal diffusion sheets are used to dissipate heat from electronic components, such as central processing units (CPU) or integrated circuits (IC) or LEDs, to avoid damage caused by heat concentration. This type of thermal diffusion sheet is generally arranged between the radiators or between the electronic components and the housing, so that the heat generated by the heating components is conducted to the radiator or the housing for heat d...

AI Technical Summary

Problems solved by technology

However, if pure metal materials are used for thermal diffusion, there may be the following problems. The metal's electrical conductivity is too good, which may cause short circuits in electronic components.

At the same time, the thermal conductivity of metal materials is isotropic, usually about 100W / m·K to 400W / m·K in the direction of the plane and the direction of thickness, the thermal conductivity is good, and the heat dissipation function in the plane is not good.

Images