Assembling method of welding columns used for ceramic column grid array packaging

A technology of ceramic packaging and column grid array, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., which can solve the problems of difficult processing accuracy, high cost, and easy damage to welding posts, so as to ensure assembly accuracy and position accuracy , Easy to install, easy to use, easy to disassemble

Active Publication Date: 2013-08-21
WUXI ZHONGWEI GAOKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has the following disadvantages in actual use: 1. The graphite tool itself is relatively brittle, easily damaged and accompanied by graphite powder, which affects installation and service life; 2. The graphite tool can only be processed by machining. For 1.0mm It is difficult to guarantee the processing accuracy of tools with more than 1,000 pitches and welding columns, and the processing cost of graphite tools is expensive; 3. The welding columns used in CCGA circuits are relatively soft. It is easy to damage the welding post during the process of lowering the graphite tool; 4. The graphite tool must be used in a special vacuum furnace or a high-temperature heating furnace by adding electrodes, so its scope of application is limited; 5. The number of different welding posts, different Circuits with different pitches and different dimensions and structures must be processed and positioned with special graphite tools. The installation process changes with the variety of graphite tools; for example: CCGA 717 graphite tools with a pitch of 1.0mm cannot be used for CCGA1144 with a pitch of 1.0mm Installation of welding pillars; CCGA717 graphite tools with a pitch of 1.27mm cannot be used for the installation of CCGA717 pitch 1.0mm welding pillars; changes in the external dimensions and positions of welding pillars must use matching special graphite tools, etc., which are expensive

Method used

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  • Assembling method of welding columns used for ceramic column grid array packaging
  • Assembling method of welding columns used for ceramic column grid array packaging
  • Assembling method of welding columns used for ceramic column grid array packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Embodiment one: if figure 1 , figure 2 As shown, a CCGA1144 packaged product with a pitch of 1.00 mm is assembled with Sn10Pb90 soldering pillars 5 with a diameter of 0.52 mm. The post welding method of this product includes the following steps:

[0037] (1) if Figure 3-1 , Figure 3-2 As shown, according to the external dimensions of the CCGA1144 packaged product, the ceramic positioning frame 1 is made of Kovar alloy material, and the middle part of the ceramic positioning frame 1 is a cavity whose size and shape match the CLGA1144 circuit ceramic body 6;

[0038] (2) if Pic 4-1 , Figure 4-2 As shown, according to the external dimensions of the CCGA1144 packaged product, the carrier sheet 2 is made of Kovar alloy material with a thickness of 0.35mm, and the carrier sheet 2 is used to prevent the slipping of the welding posts 5 and ensure the coplanarity of all the welding posts 5;

[0039] (3) if Figure 5-1 , Figure 5-2As shown, according to the external...

Embodiment 2

[0045] Embodiment two: if figure 1 , figure 2 As shown, a CCGA1144 packaged product with a pitch of 1.00 mm is assembled with Sn10Pb90 soldering pillars 5 with a diameter of 0.52 mm. The post welding method of this product includes the following steps:

[0046] (1) if Figure 3-1 , Figure 3-2 As shown, according to the external dimensions of the CCGA1144 packaged product, the ceramic positioning frame 1 is made of Kovar alloy material, and the middle part of the ceramic positioning frame 1 is a cavity whose size and shape match the CLGA1144 circuit ceramic body 6;

[0047] (2) if Pic 4-1 , Figure 4-2 As shown, according to the external dimensions of the CCGA1144 packaged product, the carrier sheet 2 is made of Kovar alloy material with a thickness of 0.35mm, and the carrier sheet 2 is used to prevent the slipping of the welding posts 5 and ensure the coplanarity of all the welding posts 5;

[0048] (3) if Figure 5-1 , Figure 5-2 As shown, according to the externa...

Embodiment 3

[0054] Embodiment three: as figure 1 , figure 2 As shown, a CCGA1144 packaged product with a pitch of 1.00 mm is assembled with Sn10Pb90 soldering pillars 5 with a diameter of 0.52 mm. The post welding method of this product includes the following steps:

[0055] (1) if Figure 3-1 , Figure 3-2 As shown, according to the external dimensions of the CCGA1144 packaged product, the ceramic positioning frame 1 is made of Kovar alloy material, and the middle part of the ceramic positioning frame 1 is a cavity whose size and shape match the CLGA1144 circuit ceramic body 6;

[0056] (2) if Pic 4-1 , Figure 4-2 As shown, according to the external dimensions of the CCGA1144 packaged product, the carrier sheet 2 is made of Kovar alloy material with a thickness of 0.35mm, and the carrier sheet 2 is used to prevent the slipping of the welding posts 5 and ensure the coplanarity of all the welding posts 5;

[0057] (3) if Figure 5-1 , Figure 5-2 As shown, according to the exter...

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Abstract

The invention relates to an assembling method of welding columns used for ceramic column grid array packaging. The method comprises the steps of (1) manufacturing a porcelain body positioning frame, a loading bearing plate and welding column carriers with Kovar materials and etching welding column positioning holes distributed in an array mode in each welding column carrier, (2) installing the load bearing plate on the bottom of the porcelain body positioning frame, installing the plurality of welding column carriers on the load bearing plate and installing the welding columns in the welding column positioning holes, (3) printing welding paste on a welding disc corresponding to a circuit porcelain body, (4) installing the circuit porcelain body with the welding paste printed on in the porcelain body positioning frame and enabling the welding paste to correspond to the welding columns in a one-to-one mode, (5) placing the welding columns, the porcelain body positioning frame and the circuit porcelain body with the welding paste printed on in a reflow furnace and welding the welding columns and the circuit porcelain body at a temperature between 210 DEG C and 230 DEG C, and (6) taking down the welding column carriers from the circuit porcelain body, leaving the circuit porcelain body and obtaining a packaging product. According to the assembling method of the welding columns used for ceramic column grid array packaging, assembly of welding columns used for CCGA circuits with different sizes and pitches can be achieved, and damage on the welding columns in a jig dismantling process is avoided.

Description

technical field [0001] The invention relates to a method for assembling welding columns for a column grid array ceramic package, in particular to a method for accurately assembling various welding columns on a ceramic carrier (CLGA) with corresponding pads to form a column grid array ceramic package ( The invention discloses an assembly method of a CCGA) device, belonging to the technical field of microelectronic packaging. Background technique [0002] With the enhancement of the functions of semiconductor integrated circuit devices, the number of I / O (input and output ports) at the leading end is increased, and the leading ends of the package are all arranged in an area array. At present, welding pillars for pillar grid array ceramic packages (CCGA) usually use welding pillars with a diameter of 0.52 mm and a height of 2.54 mm, with a pitch of 1.27 mm or 1.00 mm. [0003] At present, the installation of welding posts for column grid array ceramic package (CCGA) usually ad...

Claims

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Application Information

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IPC IPC(8): H01L21/48
Inventor 杨兵张顺亮李耀
Owner WUXI ZHONGWEI GAOKE ELECTRONICS
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