Thin-film encapsulation structure of top light-emitting OLED device and preparing method thereof
A thin-film packaging and top-emitting technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problem of luminous attenuation device efficiency and life attenuation, higher than the tolerance range of OLED devices, organic materials or metal electrode damage and other problems, to achieve the effects of simplifying the production process, facilitating popularization and use, and convenient operation
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Example Embodiment
[0028] Example 1
[0029] The thin film packaging structure of the top-emitting OLED device in this embodiment, such as figure 1 Said, comprising a substrate 1 and a reflective anode 2, a hole transport layer 3, a light-emitting layer 4, an electron transport layer 5, a semi-transparent cathode 6 and a thin film encapsulation layer 8, which are sequentially superimposed on the substrate 1, and an encapsulation buffer layer 7, The packaging buffer layer 7 is arranged between the semi-transparent cathode 6 and the thin film packaging layer 8.
[0030] Among them, the encapsulation buffer layer 7 is a fluorescent material with a thickness of 1 nm and emitting red light, such as coumarin, aromatic compounds and their derivatives.
[0031] The method for preparing the thin film packaging structure of the top-emitting OLED device of this embodiment includes the following steps:
[0032] In step 1, the reflective anode 2, the hole transport layer 3, the light emitting layer 4, the electron ...
Example Embodiment
[0037] Example 2
[0038] The thin film packaging structure of the top-emitting OLED device in this embodiment is the same as that of Embodiment 1, as figure 1 Shown.
[0039] The encapsulation buffer layer 7 of the thin-film encapsulation structure of the top-emitting OLED device is a fluorescent luminescent material with a thickness of 3 nm and emitting green light, such as coumarin derivatives, quinacridones and their derivatives, and polycyclic aromatic hydrocarbons. Compounds and their derivatives, 1H-pyrazolo[3,4-b]quinoxaline green fluorescent dopants.
[0040] The method for preparing the thin film packaging structure of the top-emitting OLED device of this embodiment includes the following steps:
[0041] In step 1, the reflective anode 2, the hole transport layer 3, the light emitting layer 4, the electron transport layer 5, and the semi-transparent cathode 6 are sequentially prepared on the substrate 1 by a thermal evaporation method;
[0042] Step 2: Prepare the package bu...
Example Embodiment
[0046] Example 3
[0047] The thin film packaging structure of the top-emitting OLED device in this embodiment is the same as that of the first embodiment, such as figure 1 Shown.
[0048] The packaging buffer layer 7 of the thin-film packaging structure of the top-emitting OLED device is a fluorescent light-emitting material with a thickness of 6 nm and emitting blue light, such as TBP, TPP, DSA, DSA-Ph, BD-1, BD-2, BD-3 .
[0049] The method for preparing the thin film packaging structure of the top-emitting OLED device includes the following steps:
[0050] In step 1, the reflective anode 2, the hole transport layer 3, the light emitting layer 4, the electron transport layer 5, and the semi-transparent cathode 6 are sequentially prepared on the substrate 1 by a thermal evaporation method;
[0051] Step 2: Prepare the package buffer layer 7 by thermal evaporation method on the plated translucent cathode 6;
[0052] Step 3 prepare a polymer film encapsulation layer on the encapsulatio...
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