Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat-sealing films and wrapping tapes for packaging electronic components

A technology of heat-sealing film and covering tape, which is applied to the structural parts of electrical equipment, packaging, and electrical components. The effect of good optical properties and good mechanical properties

Active Publication Date: 2015-09-23
3M CHINA
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The strength at which the covering tape is peeled off from the carrier tape is called "peel-off strength", and when the strength is too low, there is a problem that the covering tape comes off when the packaging is transported and the packaged electronic parts fall down
For these reasons, agglomerates or degradation products appear during the formation of cohesive failure layers and in many cases reduce productivity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat-sealing films and wrapping tapes for packaging electronic components
  • Heat-sealing films and wrapping tapes for packaging electronic components
  • Heat-sealing films and wrapping tapes for packaging electronic components

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0068] Preparation of materials for functional layers :

[0069] 67.5 kg of styrene-butadiene block copolymer (CHI MEI, PB-5903), 37.5 kg of poly(vinyl acetate) (HyunDai, VA60), 45 kg of intrinsically antistatic polymer ( IDP: PolyNova PNC300R-M) and 0.6kg of Antioxidant A5 (Jinhai Albemarle, Shanghai Jinhai Albemarle Fine Chemicals Co, Ltd.) were stirred evenly and heated at 180°C melt mixing, followed by cooling and granulation for further applications.

[0070] Preparation of Heat Seal Film and Cover Tape :

[0071] 1. A 16 μm thick biaxially stretched polyester film treated with corona discharge on one side was prepared. The corona-discharge-treated surface was coated with a polyurethane-based primer about 0.2 μm thick, followed by baking in an oven. Simultaneously, the polymer alloy prepared for the functional layer was melt-coated onto the primer-coated polyester film, and the obtained product was subsequently cooled and wound. The functional layer has a thicknes...

example 2

[0076] Preparation of materials for functional layers :

[0077] 67.5kg of styrene-butadiene block copolymer (CHI MEI, PB-5903), 37.5kg of polyvinyl acetate (Hyundai, VA60), 45kg of inherent antistatic polymer (IDP: PolyNova PNC300R-M) and 0.6kg of Antioxidant A5 (Jinhai Yabao, Shanghai Jinhai Yabao Fine Chemical Co., Ltd.) were uniformly stirred, and melt mixed at 180 ° C, followed by cooling and granulation for further application .

[0078] Preparation of Heat Seal Film and Cover Tape :

[0079] 1. A 16 μm thick biaxially stretched polyester film treated with corona discharge on one side was prepared. The corona-discharge-treated surface was coated with a polyurethane-based primer about 0.2 μm thick, followed by baking in an oven. Simultaneously, the polymer alloy prepared for the functional layer was melt-coated onto the primer-coated polyester film, and the obtained product was subsequently cooled and wound. The functional layer has a thickness of 30 μm and a 1×10...

example 3

[0084] Preparation of materials for functional layers :

[0085] 80kg of styrene-butadiene block copolymer (CHI MEI, PB-5903), 20kg of poly(vinyl acetate) (Hyundai, VA60) and 0.4kg of antioxidant A5 (Jinhai Yabao , Shanghai Jinhai Yabao Fine Chemical Co., Ltd.) were uniformly stirred and melt-mixed at 180° C., followed by cooling and granulation for further applications.

[0086] Preparation of Heat Seal Film and Cover Tape :

[0087] 1. The material prepared for the functional layer is formed into a film by blow molding and wound up for further application. The thickness of the film was 35 μm.

[0088] 2. A 12 μm thick biaxially stretched polyester film treated with corona discharge on one side was prepared. The corona treated surface was coated with polyurethane glue (35%, adhesive from MITSUI TAKEDA CHEMICAL JNC, 3 / 1 for A-969V / A-5). After baking, the thickness of the glue is about 2 μm. The prepared functional layer film was combined with the surface of the polyes...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
tensile strengthaaaaaaaaaa
peel strengthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a heat-sealing film for packaging an electronic element, comprising: a base layer; at least one intermediate layer which is provided on the base layer and comprises a mixture comprising, in terms of 100% by weight of the total weight of the intermediate layer, 5-70 % by weight of a vinyl acetate copolymer, wherein the units derived from vinyl acetate comprise more than 10% by mole of the copolymer, 20-90 % by weight of a styrene-butadiene copolymer, and 0-40 % by weight of a conductive polymer; and at least a heat-sealing layer which is provided on the surface of the intermediate layer opposite to the base layer. The invention further provides a cover tape made of the heat-sealing film as described above.

Description

technical field [0001] The present invention relates to a heat-sealing film and a covering tape made of the heat-sealing film and capable of heat-sealing a plastic carrier tape in which storage recesses are formed, The carrier tape is one of packages having functions that electronic parts are protected from contamination when the electronic parts are stored, transported, or installed, and they are arranged and taken out to be assembled on an electronic circuit substrate. Background technique [0002] Recently, surface mount type electronic parts such as ICs, transistors, diodes, condensers, piezoelectric element resistors, etc. are packaged into packages composed of plastic carrier tapes in which embossed emboss-molded pockets, the electronic components can be housed in the pockets conforming to their shape, and the cover tape is heat-sealed to the carrier tape, which is then supplied. After peeling off the cover tape from the carrier tape, the packaged electronic parts are...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/00B65D43/00H05K7/00
CPCB32B27/32B32B2250/24B32B2307/21B32B2405/00B32B2307/54B32B27/306B32B27/08B32B2307/31B32B2255/10B32B27/302B32B2307/202B32B2270/00B32B27/36B32B2553/00B32B27/20B32B2307/412
Inventor 张伟祥金舟沈时骏张琳琳李佳军
Owner 3M CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com