SPR sensor cell and SPR sensor
A sensor unit and cladding technology, which is applied in the field of SPR sensor unit and SPR sensor, can solve the problems such as the difficulty of fixing samples for metal thin film analysis, and achieve the effect of improving detection sensitivity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0146] A roughly prism-shaped core layer with a thickness of 50 μm and a width of 50 μm is formed on a silicon substrate (substrate) using a photosensitive epoxy resin (see image 3 (a)).
[0147] Next, using a photosensitive epoxy resin having a lower refractive index than the photosensitive epoxy resin used to form the core layer, an under clad layer is formed on the silicon substrate so as to cover the core layer so that the area from the upper surface of the core layer 100µm thick (refer to image 3 (b)).
[0148] Next, the silicon substrate is peeled off from the lower cladding and core layers (see image 3 (c)), so that the lower cladding layer and the core layer are turned upside down.
[0149] Next, a silicon dioxide film with a thickness of 10 nm was formed as a protective layer on the lower cladding layer and the core layer by sputtering (refer to image 3 (d)).
[0150] Next, a gold thin film with a thickness of 50 nm and a width of 1 mm is formed on the protec...
Embodiment 2
[0155] An SPR sensor cell was obtained in the same manner as in Example 1 except that an aluminum oxide thin film having a thickness of 10 nm and a width of 1 mm was formed as the cover layer instead of the silicon dioxide thin film. The contact angle of the covering layer to water was measured by the static drop method based on JIS R3257 and found to be 78.2°.
Embodiment 3
[0157] A roughly prism-shaped core layer with a thickness of 50 μm and a width of 50 μm is formed on a silicon substrate (substrate) using a photosensitive epoxy resin (see Figure 5 (a)).
[0158] Next, using a photosensitive epoxy resin having a lower refractive index than the photosensitive epoxy resin used to form the core layer, an under clad layer is formed on the silicon substrate so as to cover the core layer so that the area from the upper surface of the core layer 100µm thick (refer to Figure 5 (b)).
[0159] Next, the silicon substrate is peeled off from the lower cladding and core layers (see Figure 5 (c)), so that the lower cladding layer and the core layer are turned upside down.
[0160] Next, a silicon dioxide film with a thickness of 10 nm was formed as a protective layer on the lower cladding layer and the core layer by sputtering (refer to Figure 5 (d)).
[0161] Next, a 3% by mass ethanol solution of γ-aminopropyltriethoxysilane (silane coupling age...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 