Tin, silver, copper and nickel welding material and preparation method thereof

A technology of tin-silver-copper and solder, which is applied in the field of tin-silver-copper-nickel solder and its preparation, can solve the problems of high melting point, coarse crystallization, and low wettability, and achieve low melting point, fine grain, and high wettability Effect

Active Publication Date: 2013-09-04
东莞翰能企业管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned lead-free tin solder has the defe

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A tin-silver-copper-nickel solder, which is composed of the following raw materials in weight percentage: 1% copper, 0.2% silver, 0.1% nickel, 0.01% scandium, 0.03% ytterbium, 0.01% samarium, and the rest is tin.

[0044] A preparation method of tin-silver-copper-nickel solder, which comprises the following steps:

[0045] Step A, take the copper, silver, tin, nickel, scandium, ytterbium, samarium of formula quantity;

[0046] Step B. Put the tin weighed in step A into a smelting vessel, pass through argon protection, and first raise the temperature to 480°C. After the tin is completely melted, put the copper, silver, nickel, scandium, ytterbium, Add samarium into the smelting vessel, stir, smelt at 1600°C for 15 minutes, and cool in four stages:

[0047] B1. Cool down to 1100°C and keep it warm for 20 minutes at this temperature;

[0048] B2. Cool down to 850°C and keep it warm for 20 minutes at this temperature;

[0049] B3. Cool down to 300°C, and keep warm for 20...

Embodiment 2

[0052] A tin-silver-copper-nickel solder, which is composed of the following raw materials in weight percentage: 3% copper, 0.3% silver, 0.2% nickel, 0.02% scandium, 0.04% ytterbium, 0.02% samarium, and the rest is tin.

[0053] A preparation method of tin-silver-copper-nickel solder, which comprises the following steps:

[0054] Step A, take the copper, silver, tin, nickel, scandium, ytterbium, samarium of formula quantity;

[0055] Step B. Put the tin weighed in step A into a smelting vessel, pass through argon protection, and first raise the temperature to 500°C. After the tin is completely melted, put the copper, silver, nickel, scandium, ytterbium, Add samarium into the smelting vessel, stir, smelt at 1700°C for 13 minutes, and cool in four stages:

[0056] B1. Cool down to 1150°C and keep it warm for 25 minutes at this temperature;

[0057] B2. Cool down to 900°C and keep it warm for 25 minutes at this temperature;

[0058] B3. Cool down to 350°C, and keep it warm for...

Embodiment 3

[0061] A tin-silver-copper-nickel solder, which is composed of the following raw materials in weight percentage: 5% copper, 0.4% silver, 0.2% nickel, 0.03% scandium, 0.07% ytterbium, 0.05% samarium, and the rest is tin.

[0062] A preparation method of tin-silver-copper-nickel solder, which comprises the following steps:

[0063] Step A, take the copper, silver, tin, nickel, scandium, ytterbium, samarium of formula quantity;

[0064] Step B. Put the tin weighed in step A into a smelting vessel, pass through argon protection, and first raise the temperature to 530°C. After the tin is completely melted, put the copper, silver, nickel, scandium, ytterbium, Add samarium into the smelting vessel, stir, smelt at 1800°C for 10 minutes, and cool in four stages:

[0065] B1. Cool down to 1200°C and keep it warm for 30 minutes at this temperature;

[0066] B2. Cool down to 950°C and keep it warm for 30 minutes at this temperature;

[0067] B3. Cool down to 400°C and keep warm for 30m...

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PUM

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Abstract

The invention relates to the technical field of welding materials, in particular to a tin, silver, copper and nickel welding material and a preparation method thereof. The welding material contains tin, silver, copper and nickel, and further contains scandium, ytterbium and samarium. According to the tin, silver, copper and nickel welding material and the preparation method thereof, the scandium which can effectively improve intensity, hardness and heat resistance of alloy, and a heavy rare earth element of the ytterbium and a light rare earth element of the samarium which have the best plasticity are chosen on the basis of the tin, the silver, the copper and the nickel, metallographic structure of the welding material is adjusted by using phase transition properties of the samarium under different temperature, and by using the characteristics of corrosion resistance, fine grains, and uniformity and compactness of the ytterbium, spread ability and refining alloy grains of the welding material are finally improved, wetting ability and creep resistance of welding spots of the welding material are effectively improved, and welding performance and reliability of the welding material are improved. Furthermore, the metallographic structure of the welding material is greatly improved through a mode of cooling by stages. In a word, the tin, silver, copper and nickel welding material which is low in melting point, large in wetting ability, even in crystal phase structure is obtained by combining the above kinds of metal.

Description

technical field [0001] The invention relates to the technical field of solder, in particular to a tin-silver-copper-nickel solder and a preparation method thereof. Background technique [0002] With the rapid development of the electronic industry, the requirements for electronic products are getting higher and higher. There are many types of solder used in electronic products, but most of them still use tin-lead alloy solder. Because the lead in tin-lead solder pollutes the environment, so The European Union issued two directives to prohibit the use of lead-containing tin solder in electronic products from July 1, 2006. Most of the existing lead-free solders are tin-silver, tin-copper, tin-silver-copper, tin- Zinc-indium-bismuth, tin-antimony-silver-indium, tin-zinc-nickel, etc., and a few are tin-copper-nickel. [0003] For example, the Chinese invention patent with the patent number ZL01808699.3 introduces a lead-free solder alloy and electronic parts using the alloy. A...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 赖明江陈婷
Owner 东莞翰能企业管理有限公司
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