PECVD (plasma enhanced chemical vapour deposition) film-coating system

Abstract

The invention discloses a PECVD (plasma enhanced chemical vapour deposition) film-coating system. The PECVD film-coating system comprises a process system, a loading-unloading system and a valve mechanism, wherein the process system comprises a process cavity and a process reaction chamber; the process reaction chamber is arranged in the process cavity; the loading-unloading system comprises a loading-unloading cavity and a transmission manipulator; the transmission manipulator is slidably arranged between the loading-unloading cavity and the process cavity; the valve mechanism is arranged between the process cavity and the loading-unloading cavity and used for communication or isolation between the process cavity and the loading-unloading cavity, and via the valve mechanism, the transmission manipulator can perform a reciprocating motion in the cavities, and mutual communication between the cavities and the mutual independence of vacuum environments are ensured simultaneously; the loading-unloading cavity also has the functions of a loading cavity and a transit transmission cavity, and can meet the functions of loading and unloading for a substrate, and mutual transmission between the cavities; and due to only two cavities, the structure is simpler, so that equipment cost is low, installation and maintenance are simple and convenient, transmission structure is simple and convenient, and requirements on mechanical accuracy are low.

Description

technical field [0001] The invention relates to the field of vacuum coating, in particular to a PECVD coating system. Background technique [0002] Plasma Enhanced Chemical Vapor Deposition (hereinafter referred to as PECVD) technology is a process of chemical vapor deposition using glow discharge to generate plasma. Most of the radio frequency discharge technology is used to accelerate electrons with an external radio frequency power supply. These high-energy electrons collide with the process gas, resulting in decomposition, compounding, excitation and ionization processes, resulting in a large number of charged ions, free radicals and active groups. These have high Active chemical groups undergo a series of chemical reactions on the surface of the sample placed on the electrode to form a solid film. This technology has the advantages of low working temperature, fast deposition rate, good film compactness, and good process repeatability; this technology was developed in t...

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Problems solved by technology

[0003] At present, the main structural types of PECVD systems are: 1. In-line type. This type of equipment was first used in the manufacturing line of TFT-LCD production. The substrates are sequentially entered into the process cavity, and the layers of the film are prepared sequentially. This will cause The production cycle is too long and the production cost is too high; secondly, the substrate is erected in the chamber when the film is formed, and the diffraction problem is prone to occur when the film layer is prepared. As the substrate size increases, the diffraction problem becomes more serious. equipment replacement

2. Batch type, this type of equipment is used to process multiple substrates in one process chamber at the same time, and the production efficiency is high; but because the discharge electrodes of the substrate will interfere with each other, the plasma will be unstable, and the film layer of the substrate will be caused Poor uniformity and consistency

However, since the PECVD system is composed of several vacuum chambers, the equipment structure is complex and expensive, and the maintenance of the equipment is difficult and costly. At the same time, due to the fast and reliable operation, it requires extremely high mechanical precision, which increases the difficulty of equipment manufacturing, installation and debugging. Moreover, when the substrate is transported and operated in the chamber, it is easy to get stuck or the substrate is damaged.

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