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Grinding method of diamond surface

A grinding method and diamond technology, applied in machine tools, grinders, abrasives and other directions suitable for grinding workpiece planes, can solve problems such as uncomfortable grinding and short tool life.

Active Publication Date: 2016-05-18
TOYO SEIKAN GRP HLDG LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] So far, the diamond surface has been mechanically ground by using diamond grains or grinding stones, which takes a long time
In addition, since both are worn, there are problems such as short tool life and unsuitability for grinding three-dimensional surfaces with unevenness

Method used

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  • Grinding method of diamond surface
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  • Grinding method of diamond surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0091] The present invention will now be described through the following experimental examples.

[0092] In the experimental example, the surface roughness was measured by the following method.

[0093] Surface roughness:

[0094] The maximum height Rz was measured according to JIS-B-0601 by using a surface roughness meter (Surfcom575A) manufactured by Tokyo Seimitsusha Co..

experiment example 1

[0096] use figure 1 The structure of a polishing tester and a test piece to be polished obtained by coating a substrate of a cemented carbide with diamond by the hot filament CVD method are schematically shown.

[0097] Test piece:

[0098] Shape: 13mm×13mm (5mm thick) flat plate

[0099] Base material: super hard alloy

[0100] Diamond thickness: 10μm

[0101] Maximum height Rz: 1.5μm (diamond surface)

[0102] Laser (CO2 gas laser), Evolution100W,

[0103] Manufactured by SynradCo.:

[0104] Output: 100W

[0105] Illumination width (spot diameter):

[0106] Mount the Ta wiring with a circular cross section and a diameter of 1 mm as a polishing member to the above-mentioned polishing tester (see image 3 (a)), and the gap between the laser irradiation position and the contact position of the polishing member and the test piece is set to 2 mm. In this state, the polishing member (Ta wiring) was pushed onto the surface of the test piece with a load of 10N, and the test piece was polished b...

experiment example 2

[0110] Except that the laser beam was not irradiated, the polishing test was performed in exactly the same manner as in Experimental Example 1.

[0111] As a result, the diamond surface is not completely ground.

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Abstract

The invention provides a diamond surface grinding method, wherein the generation of abrasive powder can be reduced, the service life of the grinding member can be prolonged, the grinding member can be easily controlled, a surface with high smoothness can be obtained, and the concave-convex three-dimensional surface can be easily ground. A method of grinding a diamond surface (1a), said method being characterized in that, using a grinding member (3a) having a surface formed of carbon and a reactive metal or carburizing metal, the diamond surface is ground with the grinding member (3a) Before (1a), the diamond surface (1a) is irradiated with a laser beam (5), and the abrasive member (3a) is rubbed against the laser beam irradiated portion after the laser beam is emitted.

Description

Technical field [0001] The present invention relates to a method for grinding diamond surfaces, and more specifically, to a method for grinding various diamond surfaces. Background technique [0002] It is well known that diamond, which is a carbon crystal, is used for various purposes due to its very high hardness, excellent wear resistance, and excellent slipping property, thermal conductivity, and high refractive index. For example, it has been used for cutting tools such as knives, end mills and files, plastic machining metal molds such as punches and dies, sliding components such as valve lifters and bearings, such as radiators, etc. Components, electronic circuit boards, and optical components such as lenses and windows. [0003] In order to fully utilize their characteristics, these diamond products must have a diamond surface ground to a smooth surface. [0004] So far, it has taken a long time to mechanically grind the diamond surface by using diamond particles or grinding...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00B24B21/04
CPCB24B1/00B24B7/02B24B7/22B24B9/166B24B19/22B24B21/04B24B21/16B24D3/06
Inventor 城石亮藏高尾健一
Owner TOYO SEIKAN GRP HLDG LTD