Photoresist stripping fluid composition and application thereof

A technology of stripping liquid and composition, which is applied in the direction of photosensitive material processing, etc., can solve the problems of easy corrosion and easy corrosion of metal lines, etc., and achieve the effect of avoiding corrosion

Inactive Publication Date: 2013-09-11
CHI MEI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the above known photoresist stripping solutions have excellent photoresist stripping properties, they are particularly prone to corrosion for metal circuits, especially aluminum metal circuits.
[0006]

Method used

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  • Photoresist stripping fluid composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] The positive-type photosensitive resin composition of novolak resin system is placed in a coating machine (model is MS-A150; purchased from Shin Kong Trading, Taiwan), and coated on a 2 inch × 2 inch surface by spin coating. On the glass substrate containing the aluminum metal film, dry it under reduced pressure at 100mmHg for 5 seconds, then pre-bake it in an oven at 110°C for 1.5 minutes to form a pre-baked coating film with a film thickness of 3.5 μm. The pre-baked coating film is placed between the specified masks (mask), and the stepping machine (Nikon1755G7A) is used at 20mJ / cm 2 After irradiating with a certain amount of light, develop with 0.84% ​​potassium hydroxide aqueous solution at 23°C for 1 minute, remove the coating film on the exposed part of the substrate, and then wash it with pure water. Then, post-bake at 170° C. for 15 minutes in an oven to form a photoresist line film with a film thickness of 3.0 μm on the glass substrate containing the aluminum m...

Embodiment 2 to 9 and comparative example 1 to 3

[0053] Examples 2 to 9 and Comparative Examples 1 to 3 use the same operating method as in Example 1, the difference is that the type and mixing amount of the photoresist stripper composition are changed, and the detailed information and follow-up evaluation results are set out in the table 1.

[0054] 1. Photoresist stripping property:

[0055] The above-mentioned glass substrate with aluminum-containing metal circuit was used to observe the situation of photoresist residue by SEM, and evaluated according to the following criteria:

[0056] ◎: No photoresist residue

[0057] ○: A little photoresist remains

[0058] ╳: A large number of photoresist residues

[0059] 2. Corrosion resistance of aluminum-containing metal lines:

[0060] The aforementioned glass substrates with aluminum-containing metal circuits were observed by SEM to observe the surface of the aluminum-containing metal circuits, and were evaluated according to the following criteria:

[0061] ○: There is no...

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Abstract

The invention discloses a photoresist stripping fluid composition comprising an alcamine compound (A), a glycols and/or alcohol ether compound (B) and a sulfone and/or sulfoxide organic solvent (C). Through use of the above photoresist stripping fluid composition, photoresists formed on a metal line can be completely removed while the metal line can be prevented from being corroded. The invention also discloses a photoresist stripping method.

Description

technical field [0001] The present invention relates to a photoresist stripper composition, and in particular to a photoresist stripper composition suitable for removing the photoresist on the formed metal wiring and avoiding corrosion of the metal wiring, and application. Background technique [0002] Recently, with the evolution of the photolithography process, the circuit layout has become more and more refined. Therefore, in addition to the improvement of the exposure technology and the composition of the photoresist, more and more attention has been paid to the technology of the photoresist stripping step. [0003] The photoresist stripping step has been widely used in the lithography process, and the photoresist on the formed metal wiring can be removed by using the photoresist stripping solution. The following exemplifies the manufacturing process of the semiconductor circuit and the electrode region of the liquid crystal panel, and summarizes the known photoresist s...

Claims

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Application Information

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IPC IPC(8): G03F7/42
Inventor 刘骐铭施俊安
Owner CHI MEI CORP
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