Copper-platinum alloy wire for connecting in semiconductor apparatus

A platinum alloy and semiconductor technology, which is applied in the field of copper-platinum alloy wire, can solve instability and other problems, and achieve the effect of preventing chip cracking and not improving dynamic strength
CN103295993AActive Publication Date: 2013-09-11TANAKA DENSHI KOGYO
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
TANAKA DENSHI KOGYO
Publication Date
2013-09-11

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Abstract

The invention relates to a copper-platinum alloy wire for connecting in a semiconductor apparatus. The copper-platinum alloy wire can improve a secondary joining property, prevent chip crack in ball bonding and improve ring formation performance in copper wires for the ball bonding. During preparing element wires of continuous casting of a fusing copper-platinum alloy containing high-purity copper (Cu), by mass, 0.1-2.0 % of platinum (Pt), 1-10 ppm sulphur (S) as a non-metal element, 10-150 ppm oxygen (O), optionally together with 1-5 ppm phosphorus (P), a very thin copper layer without the platinum is formed because of segregation, is subsequently oxidized in the atmosphere and a 6-2 nm oxide film is formed on a surface layer of the wires after continuous wire drawing is carried out. According to the joining wires of 77-105 Hv Vickers hardness, the uniform oxide film improves the secondary joining property, the elements added to a matrix restrain dynamic strength during ball bonding, so that aluminum splash is prevented and static strength incapable of leading to inclination is maintained.
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Description

technical field

[0001] The present invention relates to a copper alloy wire for connecting a pad electrode and an external electrode on a semiconductor element to each other by ultrasonic-assisted thermocompression bonding, and in particular, to a copper-platinum alloy wire in which a small amount of platinum (Pt) Dissolved in a matrix rich in copper (Cu) with a purity of 99.995% by mass or higher. Background technique

[0002] With the recent rise in gold prices, copper alloy wires are attracting attention again as a substitute for the 4N gold alloy wires that have been used hitherto.

[0003] In the conventional ultrasonic-assisted thermocompression bonding employed for conventional copper alloy wires, the copper alloy bonding wire is heated by an arc while being held on an aluminum disk under a non-oxidizing atmosphere such as a nitrogen atmosphere and a hydrogen-mixed nitrogen atmosphere. Input heat and melt the end of the wire, form a ball by surface tension, and then ...

Claims

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