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Method for preparing copper-nickel solid solution powder by microwaves

A solid solution, copper-nickel technology, applied in the field of preparing copper-nickel solid solution powder, can solve the problems of high cost, difficult control of nano-particle size, complicated process, etc., and achieves the effects of low cost, overcoming difficulty in storage and easy oxidation, and simple process

Inactive Publication Date: 2013-09-18
HEILONGJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problems of complex process, high cost and difficulty in controlling the size of nanoparticles in the existing preparation method of copper-nickel solid solution powder, and proposes a method for preparing copper-nickel solid solution powder by microwave

Method used

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  • Method for preparing copper-nickel solid solution powder by microwaves
  • Method for preparing copper-nickel solid solution powder by microwaves
  • Method for preparing copper-nickel solid solution powder by microwaves

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specific Embodiment approach 2

[0028] Specific embodiment two: the difference between this embodiment and specific embodiment one is that in step one, 0.1mol / L~0.4mol / L of CuSO 4 ·5H 2 O solution and 0.1mol / L~0.4mol / L CuSO 4 ·5H 2 The O solution was mixed uniformly at a ratio of 1:1 by volume. Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0029] Specific embodiment three: the difference between this embodiment and specific embodiment one is that 0.25mol / L CuSO 4 ·5H 2 O solution and 0.25mol / L CuSO 4 ·5H 2 The O solution was mixed uniformly at a ratio of 1:1 by volume. Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 4

[0030] Embodiment 4: This embodiment differs from Embodiments 1 to 3 in that in step 1, it is placed in a constant speed stirrer and stirred at a speed of 300r / min~500r / min for 1.8h~2.2h. Other steps and parameters are the same as those in Embodiments 1 to 3.

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Abstract

The invention discloses a method for preparing copper-nickel solid solution powder by microwaves and relates to the method for preparing the copper-nickel solid solution powder. The invention aims to solve the problems that the process is complicated, the cost is high and nano-particles are hard to control in size by adopting a traditional method for preparing the copper-nickel solid solution powder. The method for preparing the copper-nickel solid solution powder by the microwaves disclosed by the invention comprises the following steps: I, mixing NiSO4.6H2O solution with CuSO4.5H2O to obtain mixed solution A; II, mixing NaOH solution and hydrazine hydrate solution to obtain mixed solution B; III, mixing the mixed solution B with the mixed solution A, and performing microwave processing to obtain original extract C; and IV, filtering, leaching and drying the original extract C to obtain the copper-nickel solid solution powder. The method for preparing the copper-nickel solid solution powder by the microwaves disclosed by the invention is suitable for the technical field of nanoengineering.

Description

technical field [0001] The invention relates to a method for preparing copper-nickel solid solution powder. Background technique [0002] As a new chemical experiment technology, microwave radiation heating has been widely used in many chemical fields such as inorganic synthesis, polymer, material chemistry, and organic synthesis. In terms of research on nanomaterials, due to their special functions, they have increasingly become the commanding heights of competition in the high-tech field. They have played an irreplaceable role in the fields of new energy materials, ecological environment materials, functional coating materials, high-performance electronic materials, and new rare earth materials. effect. [0003] During the formation of copper-nickel alloy, solute nickel atoms exist in a fixed position in the solvent copper lattice without destroying the copper crystal structure, forming a copper-nickel solid solution, so that it has the common properties of copper and nic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24
Inventor 赵东宇郭巧凤王淑敏崔文婧韩春华
Owner HEILONGJIANG UNIV
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