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Silicon-free heat-conducting gasket and preparation method thereof

A heat-conducting gasket and silicon-free technology, which is applied in the field of silicon-free heat-conducting gasket and its preparation, can solve the problems of contaminating electronic components, reducing the service life of electronic components, etc., and achieves good reproducibility, easy use and long-term use. effect of life

Inactive Publication Date: 2013-09-25
SHENZHEN DARBOND INTERFACE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the actual use process, the silicone oil in the thermally conductive silicone sheet slowly seeps out due to the continuous assembly pressure, thereby contaminating nearby electronic components, and the dust in the air will easily adhere to the seeping silicone oil. , it is possible to connect two circuit nodes that should be insulated, greatly reducing the service life of electronic components

Method used

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  • Silicon-free heat-conducting gasket and preparation method thereof
  • Silicon-free heat-conducting gasket and preparation method thereof
  • Silicon-free heat-conducting gasket and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025]

[0026]

[0027] Put the stearic acid and ACM resin into the open mill, refine the wrapped roll, then add aluminum hydroxide micropowder, plasticizer and pigment, continue the milling, add the vulcanizing agent after mixing evenly, and start the milling after 10 times of thinning Finish. Put the refined rubber into the mold, and use a four-column hydraulic press to press and vulcanize for 3 minutes at a temperature of 170°C to form a DP-1200SF standard sheet of 200*400*2mm.

[0028] The thermal conductivity of the silicon-free thermal pad prepared in this example can reach 1.0-1.5W / mK, it has surface viscosity, and it can work continuously at 100°C for 1000 hours without oil leakage or aging. It is mainly used for heat conduction in silicone oil-sensitive occasions caulking.

Embodiment 2

[0030]

[0031] Put the stearic acid and ACM resin into the open mill, refine the rolls, then add alumina micropowder, plasticizer and pigment, continue the milling, add the vulcanizing agent after mixing evenly, and finish the milling after 10 times of thinning . Put the refined rubber into the mold, and use a four-column hydraulic press to press and vulcanize for 10 minutes at a temperature of 180°C to form a DP-3000SF standard sheet of 200*400*2mm.

[0032] The thermal conductivity of the silicon-free thermal pad prepared in this example can reach 2.5-3.0W / mK, and it has surface viscosity. It can work continuously at 100°C for 1000 hours without oil leakage and aging. It also has insulation properties. It is mainly used in Heat dissipation performance requires high insulation and heat conduction.

Embodiment 3

[0034]

[0035] Put the stearic acid and ACM resin into the open mill, refine the rolls, then add alumina micropowder, plasticizer and pigment, continue the milling, add the vulcanizing agent after mixing evenly, and finish the milling after 10 times of thinning . Put the refined rubber into the mold, and use a four-column hydraulic press to press and vulcanize for 8 minutes at a temperature of 180°C to form a DP-5000SF standard sheet of 200*400*2mm.

[0036] The thermal conductivity of the silicon-free thermal pad prepared in this example can reach 5.0-5.5W / mK, and it has surface viscosity. It can work continuously at 100°C for 1,000 hours without oil leakage and aging. It is mainly used for high heat dissipation performance requirements. , heat dissipation of electronic components without insulation requirements.

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Abstract

The invention relates to a silicon-free heat-conducting gasket and a preparation method thereof. The silicon-free heat-conducting gasket comprises the following raw materials in parts by weight: 100 parts of acrylics resin, 100-1000 parts of heat conduction powder, 10-40 parts of a plasticizer,1-10 parts of a vulcanizing agent, 0-3 parts of a scorch retarder, and 0-3 parts of pigment, the prepared silicon-free heat-conducting gasket provided by the invention has good insulativity, excellent ageing resistance property, high flexibility and good autohension, is not undergoing oil leakage even though being used for a long time, and is particularly suitable for heat conduction filling gap of a silicone oil sensitive occasion.

Description

technical field [0001] The invention relates to a silicon-free heat conduction gasket and a preparation method thereof, belonging to the technical field of heat conduction interface materials. Background technique [0002] With the development of electronic instruments and equipment in the direction of light, thin, short and small, the heat generated by electronic components during operation has an increasingly serious impact on the working efficiency and service life of electronic equipment. Safe and efficient Thermal solutions are gaining more and more attention. [0003] Traditional thermal management solutions include thermal silica sheets, thermal pastes, phase change materials, etc. The base materials are all silicone rubbers made of silicone oil or silicone oil with active groups cross-linked and polymerized. Among them, the heat-conducting silicone sheet is soft, impact-resistant, easy to process, and can adapt to the heat conduction requirements of different shapes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/04C08K3/22C08K3/38C08K3/34C08K3/04C08K3/08C09K5/14
Inventor 黄晓辉万炜涛范勇
Owner SHENZHEN DARBOND INTERFACE MATERIALS
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