3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof

A packaging substrate, 3D printing technology, applied in printed circuit manufacturing, multi-layer circuit manufacturing, semiconductor/solid-state device manufacturing, etc. problem, to achieve the effect of good industrial applicability

Inactive Publication Date: 2013-09-25
数驱技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0048] The wiring layer manufactured by powder spraying or droplet spraying has low precision, which is far from the requirements of high-density interconnection;
[0049] 2. The cost of nanomaterials is high
Unfo

Method used

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  • 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof
  • 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof

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Experimental program
Comparison scheme
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Embodiment Construction

[0110] This application has been explained in the technical background, and the multilayer circuit board and the packaging substrate are no longer distinguished. This application regards a multilayer circuit board as a packaging substrate without embedded passive / active electronic devices. Therefore, in the present application, the packaging substrate includes a circuit board, especially a multilayer circuit board. Passive electronic devices include resistors, capacitors, inductors, etc. Active electronic devices include transistors, integrated circuits, chips and chip modules.

[0111] 3D printing technology has created a new concept of design and manufacturing.

[0112] One of the outstanding advantages of 3D printing technology is that it can realize parts made of functionally graded materials, and can directly manufacture parts with arbitrary complex structures. In particular, products that lose manufacturability due to complex three-dimensional structures inside, or pro...

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PUM

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Abstract

The application discloses a 3D (Three Dimensional)-printing-based package substrate and a manufacturing method thereof, which are based on re-examination on an existing package substrate (with multilayer circuit boards) and manufacturing methods of wiring layers of the package substrate. According to the application, an insulation layer and a package layer with complicated stereo structures are considered as a main body of the package substrate (with the multilayer circuit boards); passive/active electronic devices and electronic connection devices are embedded in the package layer; a lead, a guide pillar, a bonding pad and composite members with different structures are taken as the electronic connection devices, equally treated with the passive/active electronic devices and standardized. According to the technical scheme, almost all processes of the manufacturing of the wiring layer in the prior art are cancelled, and the production manner and the manufacturing technology of the package substrate (with the multiple circuit boards) are changed.

Description

technical field [0001] This application belongs to the field of packaging substrate (Package Substrate) and circuit board (Printed Circuit Board, PCB) manufacturing, and specifically relates to the use of 3D printing technology to manufacture multilayer circuit boards, especially packaging substrates. technical background [0002] Printed circuit board or printed circuit board, also known as printed circuit board or printed circuit board, is referred to as circuit board in this application. [0003] As the mounting substrate of electronic devices, circuit boards are used for electrical connection and support of electronic devices. [0004] The multilayer circuit board has a hierarchical structure, which is composed of wiring layers (top layer, bottom layer, middle wiring layer), power layer (Power), ground layer (Ground), and auxiliary layers. The auxiliary layers include the top solder mask layer and the icon layer. (legend). [0005] The wiring layer is used to realize t...

Claims

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Application Information

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IPC IPC(8): H05K1/18H05K3/34H05K3/46H01L23/498
CPCH01L23/49822H01L21/4867H05K1/186H05K3/4664H01L2924/0002B33Y80/00H01L2924/00
Inventor 江俊逢吴柏江周丽
Owner 数驱技术有限公司
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