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Sputtering Targets for Solar Cells

A technology for solar cells and sputtering targets, which is applied in the field of sputtering targets for solar cells, can solve problems such as the reduction of film homogeneity, and achieve the effects of small reduction in time-lapse and high sputtering rate.

Inactive Publication Date: 2014-10-15
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when sputtering is performed with a conventional indium target, there is a problem that the homogeneity of the obtained film decreases, especially when the sputtering has progressed to a certain extent.

Method used

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  • Sputtering Targets for Solar Cells
  • Sputtering Targets for Solar Cells
  • Sputtering Targets for Solar Cells

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0104] In (purity: 99.99% or higher) was melted at 180° C., and the resulting molten metal was poured into a metal mold to cast a flat plate-shaped ingot with a length of 100 mm, a width of 100 mm, and a thickness of 15 mm. The obtained ingot was rolled using a Nippon CLOSS rolling calender at room temperature with a reduction of 1 mm / pass to obtain a rolled sheet with a thickness of 9 mm. The obtained rolled sheet was cut into a disc shape with a diameter of 102 mm. Both surfaces were cut by 1 mm each using a milling cutter to make smooth surfaces. The rolled disk (target material) and the disc-shaped back plate made of oxygen-free copper with a diameter of 110 mm were heated on a hot plate so that the temperature would reach 130° C., with their bonding surfaces facing upward. An alloy (melting point 125°C) consisting of 50% by mass of In (purity of 99.99% or more) and 50% by mass of Sn (purity of 99.99% or more) is used as a joining material, and the 130 The molten metal a...

Embodiment 2

[0107] An indium target was produced in the same manner as in Example 1, except for the point of setting the heating temperature of the rolled circular plate and the back plate to 120° C., and the use of An alloy (melting point 115°C) composed of 90% In (purity 99.99% or more) and 10% by mass Ga (purity 99.99% or more), and the molten metal temperature of this alloy is 120°C. Various evaluations were performed on this indium target by the above-mentioned measuring method. Table 1 shows the results.

Embodiment 3

[0109] An indium target was produced in the same manner as in Example 1 except that the thickness of the flat plate-shaped ingot was 18 mm. Various evaluations were performed on this indium target by the above-mentioned measuring method. Table 1 shows the results.

[0110] In addition, when performing the above-mentioned sputtering rate measurement using this indium target, the film thickness of the indium film obtained by this sputtering is surface was observed. figure 2 The resulting images are shown.

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Abstract

The present invention provides a sputtering target for solar cells, which is characterized in that it is formed by bonding a target and a back plate using a bonding material made of indium-tin or indium-gallium alloy, the target It is obtained by applying physical stress to an ingot made of indium so that the thickness of the ingot becomes 70% or less of the original thickness. The sputtering target for a solar cell of the present invention has a high sputtering rate at the initial stage of sputtering, a small decrease in the sputtering rate over time, and can form a homogeneous indium film. That is, it can be expected that a homogeneous film can be formed at a high rate until the end of life.

Description

technical field [0001] The present invention relates to a sputtering target for a solar cell, and more specifically, to a sputtering target for a solar cell whose sputtering rate is constant until the end of life and which enables uniform film formation. Background technique [0002] An indium thin film used as a light-absorbing layer of a thin-film solar cell is generally formed by sputtering an indium-made sputtering target (hereinafter also referred to as an indium target). Since indium is a soft material and a low-melting-point metal with a melting point of 156.4° C., the indium target is often produced by casting and rolling. [0003] Patent Document 1 discloses a target manufacturing method in which, after forming a thin film of indium or the like on a back plate, molten metal such as indium is poured onto the film to integrate the back plate and the target. formed. This method is called a direct casting method as opposed to an indirect casting method in which a targ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34B23K35/26C22C13/00C22C28/00C22F1/00C22F1/16
CPCC22C30/00B23K35/262C22C13/00B23K35/26C22F1/16C23C14/0617C22F1/00C23C14/3407C22C28/00C23C14/34
Inventor 武内朋哉
Owner MITSUI MINING & SMELTING CO LTD