Composite board, preparation method thereof and composite substrate

A technology for composite substrates and composite boards, applied in chemical instruments and methods, synthetic resin layered products, film/sheet adhesives, etc., can solve the problems of brittle cured resins, limited applications, and triazine rings of cyanate resins. Structural damage and other problems, to achieve the effect of improved toughness, reduced water absorption, and good dielectric properties

Inactive Publication Date: 2013-11-13
KUANG CHI INNOVATIVE TECH
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  • Summary
  • Abstract
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  • Claims
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Problems solved by technology

But there are also some disadvantages in cyanate resin, such as: cured resin is brittle, which limits its application in the industrial field
[0005] In view of the above shortcomings, although there have been researches on the modification of cyanate resins, such as: copolymerization with other thermosetting resins, blending with thermoplastic resins, or rubber toughening modification, etc., these modification methods are very effective in making cyanate resins When the toughness increases, a large number of polar groups are introduced or the triazine ring structure of the cyanate resin is seriously damaged, resulting in the loss of the original dielectric properties of the cyanate resin, which is very important for the manufacture of high-frequency printed circuit boards. is a fatal constraint

Method used

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  • Composite board, preparation method thereof and composite substrate
  • Composite board, preparation method thereof and composite substrate
  • Composite board, preparation method thereof and composite substrate

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Experimental program
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Embodiment approach

[0038] The specific modification method of cyanate ester resin is modification by using a modifier. The implementation method includes the following sub-steps:

[0039] A. Modification of silica by coupling agent;

[0040] Coupling agents include silane coupling agents and titanate coupling agents, etc. In this example, KH550 in the silane coupling agent is used for coupling modification of silica.

[0041] B. The modified silicon dioxide and the epoxy resin are mixed at a mass ratio of 4.5-5.5:27-33, and the mixed silicon dioxide and the epoxy resin are polymerized to obtain an epoxy-silicon copolymer.

[0042] In a specific operation, the epoxy resin used is bisphenol A type epoxy resin DGEBA. Silica and epoxy resin were accurately weighed in a beaker at a mass ratio of 5:30, mixed evenly at 60°C to 80°C, cooled after the reaction was complete, and set aside. In a specific operation, the preferred temperature is 70°C.

[0043] In other embodiments, silicon dioxide and ...

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Abstract

The invention discloses a manufacturing method for a composite substrate, a modification method for a cyanate ester resin and a copper-clad plate. A manufacturing method for the copper-clad plate comprises the following steps: modifying the cyanate ester resin by using an epoxy-organosilicon copolymer so as to prepare a resin glue solution; applying the resin glue solution on a reinforcing material; drying the reinforcing material on which the resin glue solution is applied so as to obtain a bonding sheet; and overlaying the bonding sheet and a prepared conducting layer in order and carrying out curing so as to prepare the composite substrate. With such a manner, the obtained composite substrate has improved toughness, reduced water-absorbing quality and good dielectric properties.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a composite board manufacturing method, a cyanate resin modification method and a composite substrate. Background technique [0002] With the rapid development of modern industry and the increasing amount of information processing, higher and higher requirements are put forward for the information processing capability and information transmission speed of electronic products. If the substrate of the printed circuit board has a lower dielectric constant and dielectric loss, the high-frequency characteristics of the substrate can be improved, signal delay, distortion and loss, and interference between signals can be reduced to ensure high-quality signal transmission. At present, the substrate material of printed circuit boards is mainly copper-clad laminates, and the performance of traditional copper-clad laminates such as phenolic / paper base or epoxy / glass cloth can no lon...

Claims

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Application Information

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IPC IPC(8): B32B27/12B32B27/04B32B15/04B32B9/04B32B33/00C09J7/02C09J179/08C09J183/08B32B37/10B32B37/06B32B38/08B32B38/18
Inventor刘若鹏王文剑金曦胡侃
OwnerKUANG CHI INNOVATIVE TECH