Preparation method of hot-melt polyurethane resin for bonding material
A technology of polyurethane resin and bonding material, which is applied in the field of preparation of hot-melt polyurethane resin for bonding material, can solve the problems of low initial tack strength, low coating amount, low bonding strength, etc., and achieves easy oxide content Low, high bond strength, high coating weight effect
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Embodiment 1
[0041] A method for preparing a hot-melt polyurethane resin for an adhesive material, wherein the content of each component is in parts by mass: TDI:HDI:PTMEG:PEG:DBO:epoxy acrylate:organotin:antioxidant:good solvent 10:4:60:20:1.5:4.5:0.5:0.5:100.
[0042] A preparation method of a hot-melt polyurethane resin for bonding materials, the preparation process is as follows: PTMEG and PEG are dehydrated under certain conditions, an organic tin catalyst is added, stirred and mixed evenly at room temperature, then TDI and HDI are added respectively, and the temperature is raised Between 50-70°C, after a certain period of reaction, add DBO in the above ratio to the system (according to needs, you can add an appropriate amount of good solvent to adjust the viscosity), the total reaction time of the above two steps does not exceed 5 hours, and then add epoxy acrylate And the prescribed amount of antioxidant heat preservation reaction. The content of NCO is determined by titration, and...
Embodiment 2
[0048] A method for preparing a hot-melt polyurethane resin for bonding materials, wherein the content of each component is in parts by mass: IPDI: MDI: PTMEG: PCL: DBO: epoxy acrylate: tertiary amine: antioxidant: good solvent 12:20:30:30:3:5:0.5:0.5:80.
[0049] A method for preparing a hot-melt polyurethane resin for bonding materials. The preparation process is as follows: PTMEG and PCL are dehydrated under certain conditions, a tertiary amine catalyst is added, stirred and mixed evenly at room temperature, then IPDI and MDI are added respectively, and the temperature is raised. Between 50-70°C, after a certain period of reaction, add DBO in the above ratio to the system (according to needs, you can add an appropriate amount of good solvent to adjust the viscosity), the total reaction time of the above two steps does not exceed 5 hours, and then add epoxy acrylate And the prescribed amount of antioxidant heat preservation reaction. The content of NCO is determined by titr...
Embodiment 3
[0055] A method for preparing a hot-melt polyurethane resin for an adhesive material, wherein the content of each component is in parts by mass: IPDI:MDI:HDI:PTMEG:PCL:PPG:ethylene glycol:epoxy acrylate:organotin: Hydroquinone: good solvent is 8:8:16:20:20:20:3:5:0.5:1:200.
[0056] A method for preparing a hot-melt polyurethane resin for bonding materials. The preparation process is as follows: dehydrating PTMEG, PCL and PPG under certain conditions, adding an organic tin catalyst, stirring and mixing at room temperature, and then adding IPDI and HDI respectively. With MDI, heat up to 50-70°C, after a certain period of reaction, add DBO in the above ratio to the system (according to needs, add an appropriate amount of good solvent to adjust the viscosity), the total reaction time of the above two steps does not exceed 5 hours, and then add Epoxy acrylate reacts with a specified amount of antioxidant for heat preservation. The content of NCO is determined by titration, and wh...
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