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Adhesive composition and adhesive film

A technology of adhesives and compositions, applied in conductive adhesives, adhesives, film/sheet-like adhesives, etc., can solve the problems of small connection and bonding area of ​​flexible printed substrates, and achieve long-term reliability improvement, The effect of improving adhesion and adhesion improvement

Active Publication Date: 2015-08-05
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in recent years, the screen size of electronic devices such as mobile phones has rapidly increased, and along with this, the bonding area for connecting the signal extraction circuit of the touch panel to the flexible printed circuit board has been reduced.

Method used

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  • Adhesive composition and adhesive film
  • Adhesive composition and adhesive film
  • Adhesive composition and adhesive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～7、 comparative example 1～5

[0063] The resin components and silica shown in Table 1 were mixed and dispersed at the ratios (weight ratio, resin solid content conversion) shown in the table. Dispersion was carried out using a planetary kneader, and kneaded for 3 hours at a temperature of 85° C. and a rotation speed of 50 rpm. Details of the resin components and silica shown in Table 1 are as follows.

[0064] PEEA: TPAE-32 (T&K TOKA Co., Ltd.)

[0065] Crystalline polyester: Bilon GA-5300 (Toyobo Co., Ltd., Mn: 25000, glass transition temperature: -2°C, melting point: 114°C)

[0066] Polyurethane elastomer: Milactran P485RSUI (Japan Milactran Co., Ltd.)

[0067] SIBS: シブスタ-103T (Kaneka Co., Ltd.)

[0068] Silica: Admafine S0-C2 (Admatex Co., Ltd.)

[0069] The following components were added and mixed to 100 parts by weight (solid content conversion) of the said resin component, and the adhesive composition was prepared.

[0070] Conductive particles: Metal-coated resin balls (core: PMMA, first layer...

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Abstract

Provided is an adhesive composition which is free from halogens and has improved adhesiveness and improved long-term reliability compared with the conventional adhesive compositions. The adhesive composition comprises, per 100 parts by weight of a polyether-ester amide, 1-100 parts by weight of a crystalline polyester and 20-110 parts by weight of silica. A conductive paste can be prepared by adding conductive particles to the aforesaid adhesive composition.

Description

technical field [0001] The present invention relates to an adhesive composition and an adhesive film, and relates to an adhesive composition and an adhesive film suitable for use, for example, in connection with a signal extraction circuit of a touch panel and a flexible printed board. Background technique [0002] Conventionally, anisotropic conductive pastes have been used for connecting signal extraction circuits of touch panels and flexible printed circuit boards. With regard to anisotropic conductive pastes, improvement of uniformity of film thickness has been a problem until now, and with the recent increase in capacitance type touch panels, it is also required to cope with connections to finer-pitched parts. [0003] As a conventional anisotropic conductive paste, a chloroprene type is generally used (for example, patent document 1). This type has the following advantages: it is not sticky, and it can be stored at room temperature although it is short-term. [0004]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J177/12C09J7/00C09J9/02C09J11/04C09J167/00C09J7/10
CPCC09J2205/102C09J2201/602C09J9/02C08G69/44C09J7/00C09J177/12C09J167/02C08G69/40C08K3/36C08L67/02C08L77/12C09J7/10C08K2201/001C08K9/02C09J2203/326C09J2203/318C09J2301/314C09J2301/408C09J11/04
Inventor 木下淳一寺田恒彦
Owner TATSUTA ELECTRICWIRE & CABLE