Texturization additive for polycrystalline silicon slices and use method of texturization additive

Abstract

The invention provides a texturization additive for polycrystalline silicon slices. The invention further provides a texturization liquid used for texturization for the polycrystalline silicon slices, which contains an acid solution and the texturization additive for the polycrystalline silicon slices. The invention further provides a texturization method for the polycrystalline silicon slices, which is used for performing surface texturization on the polycrystalline silicon slices by virtue of the texturization liquid. The texturization additive for the polycrystalline silicon slices is applied to texture surface production for the polycrystalline silicon slices, and capable of obtaining a micro-structure texture surface which is good in uniformity and free of obvious chromatic aberration among crystalline particles, so that reflectivity is decreased, and the generation quantity of black lines is effectively reduced; the texturization additive for the polycrystalline silicon slices is used for changing a reaction mechanism and controlling a reaction speed, so that texturization can be performed in an approximate room-temperature condition, and temperature control cost is greatly decreased; roller trace can also be effectively removed, so that the silicon slices are cleaner and higher in matching with the next process, and battery performance is more stable.

Description

technical field

[0001] The invention relates to an additive for making texture of a polycrystalline silicon wafer and a method for using the same. Background technique

[0002] In the manufacturing process of polycrystalline silicon solar cells, texturing the surface of silicon wafers is a key link. The effect of texturing directly affects the conversion efficiency and yield of the final cell. Since polycrystalline silicon wafers are composed of crystal grains with different crystal orientations, and the crystal orientations of each crystal grain are randomly distributed, in the general texturing process, the wet chemical etching method of acidic solution is often used to texture the surface of polycrystalline silicon wafers. The texturing process is based on the principle of isotropic corrosion of silicon by acidic solution, forming similar pit-like textures on the surface of different grains of the silicon wafer, and the morphology of the texture has nothing to do with th...