Method for preparing polycrystalline silicon film by utilizing reusable substrate
A technology for polysilicon thin films and substrates, applied in sustainable manufacturing/processing, climate sustainability, final product manufacturing, etc., to achieve the effect of improving quality, overcoming impurity diffusion, and optimizing production processes
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Embodiment 1
[0022] according to Figure 1-3 According to the schematic diagram, a polysilicon film is prepared according to the following steps:
[0023] Step 1: Using a silicon oxide ceramic plate as a substrate, the purity of the silicon oxide ceramic plate is 99.999%;
[0024] Step 2: Coating a graphite film on the substrate with a chemical vapor deposition method, the thickness of the graphite film is 5 microns;
[0025] Step 3: preparing a polysilicon film by chemical vapor deposition on the graphite film-coated substrate;
[0026] Step 4: Using an annealing method to separate the polysilicon film from the substrate, heat the ceramic plate on which the polysilicon film has been deposited to 1000° C. under the protection of hydrogen or nitrogen, and then turn off the heating power and cool to room temperature.
[0027] Step 5: The separated substrate is used to repeatedly deposit the polysilicon film.
Embodiment 2
[0029] according to Figure 1-3 According to the schematic diagram, a polysilicon film is prepared according to the following steps:
[0030] Step 1: Using a silicon nitride ceramic plate as the substrate, the purity of the ceramic plate substrate is 99.999%;
[0031] Step 2: Coating a graphite film on the substrate by magnetron sputtering, the thickness of the graphite film is 7 microns;
[0032] Step 3: preparing a polysilicon film by chemical vapor deposition on the graphite film-coated substrate;
[0033] Step 4: Using an annealing method to separate the polysilicon film from the substrate, heat the ceramic plate on which the polysilicon film has been deposited to 1200° C. under the protection of hydrogen or nitrogen, and then turn off the heating power and cool to room temperature.
[0034] Step 5: The separated substrate is used to repeatedly deposit the polysilicon film.
Embodiment 3
[0036] according to Figure 1-3 According to the schematic diagram, a polysilicon film is prepared according to the following steps:
[0037] Step 1: Using a silicon oxide ceramic plate as a substrate, the purity of the silicon oxide ceramic plate is 99.999%;
[0038] Step 2: Coating a graphite film on the substrate with a chemical vapor deposition method, the thickness of the graphite film is 3 microns;
[0039] Step 3: preparing a polysilicon film by chemical vapor deposition on the graphite film-coated substrate;
[0040] Step 4: Using an annealing method to separate the polysilicon film from the substrate, heat the ceramic plate on which the polysilicon film has been deposited to 800° C. under the protection of hydrogen or nitrogen, and then turn off the heating power supply and cool to room temperature.
[0041] Step 5: The separated substrate is used to repeatedly deposit the polysilicon film.
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