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Surface modification process of waste epoxy molding compound

An epoxy molding compound and surface modification technology, which is applied in the field of surface modification of waste epoxy molding compound, can solve problems such as limiting the filling ratio of waste epoxy molding compound, negative impact on mechanical properties, and affecting recycling efficiency , to achieve the effect of improving interface compatibility, improving recycling rate and reducing negative impact

Inactive Publication Date: 2013-12-25
NORTH CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor interface compatibility between waste epoxy molding compound and thermoplastics, the filling of waste epoxy molding compound has a great negative impact on the mechanical properties of the plastic matrix, thus limiting the filling of waste epoxy molding compound. The input ratio affects the efficiency of its recovery

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0020] Put the strip-shaped waste epoxy molding compound into a ball mill and grind it into powder;

[0021] Take 50ml of ethanol and water to prepare a mixed solvent, take 25ml of silane coupling agent γ—(2,3-glycidoxy)propyltrimethoxysilane, dissolve it in the mixed solvent, and mix well;

[0022] Take 50g of waste epoxy molding compound powder and add it to the prepared solution, reflux and stir at 75°C for 1 hour;

[0023] The reaction solution was filtered, and the resulting filter cake was dried in a blast drying oven for 24 hours;

[0024] Grinding the dried product into powder and sieving through a 100-mesh sieve to obtain the waste epoxy molding compound powder modified by the silane coupling agent.

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PUM

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Abstract

The invention discloses a surface modification process of a waste epoxy molding compound. The process comprises the following steps: (1) ball-milling the strip waste epoxy molding compound in a ball mill to obtain powder; (2) mixing ethanol and water according to a certain proportion to manufacture a mixed solvent, and dissolving a silane coupling agent in the mixed solvent to prepare a solution; (3) adding a certain amount of waste epoxy molding compound powder into the prepared solution, and stirring in refluxing for 1 hour at a certain temperature; (4) filtering reaction liquid, and drying an obtained filter cake in a blast drying oven for 24 hours; (5) grinding the dried product, and screening by screen cloth to obtain the waste epoxy molding compound powder modified by the silane coupling agent. The process disclosed by the invention is simple in operation and low in cost, the modified waste epoxy molding compound powder and high-density polyethylene are good in interfacial compatibility, and the process is beneficial to recycling of the waste epoxy molding compound.

Description

technical field [0001] The invention relates to a surface modification process of waste epoxy molding compound, in particular to a surface modification process of waste epoxy molding compound produced in the electronic packaging process. Background technique [0002] Epoxy molding compound is insulating, heat-resistant, and low in cost, and is widely used in the field of electronic packaging. At present, more than 90% of semiconductor devices at home and abroad are packaged in epoxy molding compound. However, the main processing method of transfer molding causes about 40% of the epoxy molding compound in the potting process to become waste. Even if the scrapping of electronic components is not considered, the accumulation of waste epoxy molding compound produced in the production process pose a serious threat to the environment. The non-melting and insoluble characteristics of waste epoxy molding compound make it very difficult to process and recycle. It is an ideal recycli...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K5/5435C08L23/06
Inventor 张志明李婷婷
Owner NORTH CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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