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Copper-phosphorus solder containing hafnium, zirconium and cobalt
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A copper-phosphorus solder, zirconium-cobalt technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., to avoid oxidation or even softening of workpieces, good wettability, and easy processing.
Active Publication Date: 2016-04-13
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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However, it is not limited to the novel copper-phosphorus brazing filler metals disclosed in these documents. "Instructions"), more specifically, do not belong to "copper-phosphorus solder with P element content greater than 7.5% up to 8.0% and solder solidus temperature lower than 600°C. Under the conditions of the process, the overall performance (or some indicators) is better than BCu86SnPNi solder or BCu86SnP solder
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Embodiment 1
[0029] A new type of copper-phosphorus solder containing hafnium, zirconium and cobalt, the composition of which is: P8.0%, Sn4.5%, Co0.05%, Hf0.2%, Zr0.2%, and the balance is Cu .
[0030] The solidus temperature of the "new copper-phosphorus solder containing hafnium, zirconium and cobalt" obtained from the above composition ratio is 585°C ± 10°C, and the liquidus temperature is 645°C ± 10°C (all considering the measurement error). Use the flame brazing method, cooperate with FB102 flux, and see the data in the brackets for the brazing joint strength when the brazing base material is the following combination: red copper-H62 brass (σ b =215±25MPa, τ=205±30MPa), red copper-HPb62-3 lead brass (σ b =220±25MPa, τ=210±30MPa), red copper-HPb59-3 lead brass (σ b =220±25MPa, τ=210±30MPa).
Embodiment 2
[0032] A new type of copper-phosphorus solder containing hafnium, zirconium and cobalt, the composition of which is: P5.0%, Sn10.0%, Co0.35%, Hf0.01%, Zr0.01%, and the balance is Cu .
[0033] The solidus temperature of the "new copper-phosphorus solder containing hafnium, zirconium and cobalt" obtained from the above composition ratio is 585°C ± 10°C, and the liquidus temperature is 645°C ± 10°C (all considering the measurement error). Use the flame brazing method, cooperate with FB102 flux, and see the data in the brackets for the brazing joint strength when the brazing base material is the following combination: red copper-H62 brass (σ b =215±25MPa, τ=205±30MPa), red copper-HPb62-3 lead brass (σ b =220±25MPa, τ=210±30MPa), red copper-HPb59-3 lead brass (σ b =220±25MPa, τ=210±30MPa).
Embodiment 3
[0035] A new type of copper-phosphorus solder containing hafnium, zirconium and cobalt, the composition of which is: P7.6%, Sn7.0%, Co0.15%, Hf0.05%, Zr0.05, and the balance is Cu.
[0036] The solidus temperature of the "new copper-phosphorus solder containing hafnium, zirconium and cobalt" obtained from the above composition ratio is 585°C ± 10°C, and the liquidus temperature is 645°C ± 10°C (all considering the measurement error). Use the flame brazing method, cooperate with FB102 flux, and see the data in the brackets for the brazing joint strength when the brazing base material is the following combination: red copper-H62 brass (σ b =215±25MPa, τ=205±30MPa), red copper-HPb62-3 lead brass (σ b =220±25MPa, τ=210±30MPa), red copper-HPb59-3 lead brass (σ b =220±25MPa, τ=210±30MPa).
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Abstract
Disclosed is a copperphosphorusbrazingalloy with hafniumzirconiumcobalt, and belongs to the technical field of soldering material of metal materials. The chemical ingredients includes, by weight: 5.0% to 8.0% of P, 4.5% to 10.0% of Sn, 0.05% to 0.35% of Co, 0.01% to 0.2% of Hf, 0.01% to 0.2% of Zr, and the balance being Cu. The adding proportion of the Hf element and the Zr element is Hf : Zr =1:1. According to the copperphosphorusbrazingalloy, obtained according to the above proportion with the hafniumzirconiumcobalt, the solidus line temperature ranges from 575 to 595 DEG C, and the liquidus line temperature ranges from 635 to 655 DEG C (measuring errors are considered both). The copperphosphorusbrazingalloy with the hafniumzirconiumcobalt has the advantages of 'high phosphorus, high tin, high plasticity and low melting point', the copper phosphorus brazing alloy can be processed into fine wires with the diameter of 0.5 to 1.2mm, and the requirements of soldering when HPb62-3 lead brass and HPb59-3 lead brass are adopted to produce products in the household appliance industry and the hardware industry can be met.
Description
technical field [0001] The invention belongs to the technical field of brazing materials of metal materials, and in particular relates to a copper-phosphorus brazing material containing hafnium, zirconium and cobalt. Background technique [0002] The BCu86SnPNi solder used in the existing technology (GB / T6418-2008 "Copper-based solder"), because the P element range (mass fraction, the same below) in its chemical composition is 4.8% to 5.8%, the highest is only 5.8% , and the melting temperature range is solidus 620 ° C, liquidus 670 ° C; and BCu86SnP solder, the P element range in the chemical composition is 6.4% to 7.2%, the highest still only reaches 7.2%, and the melting temperature range is solid phase Line 650 ℃, liquidus 700 ℃, still can not meet the RoHS directive "exempt" lead brazing needs of less than or equal to 4% lead brass. Due to the implementation of the RoHS directive, in order to reduce manufacturing costs, domestic and foreign companies have adopted lead ...
Claims
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