Integrated water heating floor block and heat conducting component thereof

Abstract

The invention discloses an integrated water heating floor block. The periphery of the floor block is provided with inserting portions. The integrated water heating floor block is characterized in that the whole floor block is of a flat rectangular shape and comprises a decoration surface, a lower portion body and a heat conducting component. The inserting portion of each side of the floor block is arranged on the lower portion body. The heat conducting component comprises a pipeline portion and a heat dissipating portion. The pipeline portion is a linear pipeline arranged in the forward and backward direction. The heat dissipating portion is connected with the pipeline portion. The length of the heat conducting component in the forward and backward direction is slightly smaller than the length of the floor block with the inserting portions at the front side and the rear side removed in the forward and backward direction. The lower portion body is further provided with an installation groove enabling the front portion and the rear portion of the lower portion body to be communicated. The installation portion comprises a pipe groove portion. The pipeline portion of the heat conducting component is located in the pipe groove portion of the lower portion body. The heat conducting component adheres to and is fixed to the corresponding portion of the upper side face of the lower portion body through the lower side face of the heat dissipating portion of the heat conducting component and the decoration surface adheres to and is fixed to the corresponding portion of the upper side face of the lower portion body and the upper side face of the head dissipating portion of the heat conducting component through the corresponding portion of the lower side face of the decoration surface.

Description

technical field [0001] The invention relates to a product in the field of building decoration, in particular to an integrated water heating floor board and a heat conducting component thereof. Background technique [0002] The traditional heating in northern my country adopts centralized heating, and the pipes in the room are connected to the radiators for heating and heating. However, the convection of indoor hot air is likely to cause dust floating and air drying. The water supply temperature of the radiator group is 70-85 ℃, high energy consumption, low thermal efficiency, uneven indoor temperature, low surface temperature, and poor comfort. The radiator group needs to occupy a certain space and affects the appearance. [0003] Floor heating means that the heat medium liquid (usually water, or heat transfer oil) circulates in the disc-shaped pipes under the floor. The floor is mainly radiated, supplemented by conduction and convection to transfer heat to the room, so as...

AI Technical Summary

Problems solved by technology

In the floor heating technology with the above structure, the heat generated by the heat conduction element needs to be conducted from bottom to top to the bonding material and the floor decoration material in sequence, and a large amount of heat is absorbed by the bond material and the floor decoration material, resulting in waste of energy; secondly, due to the distance between the heat conduction elements The distance between the laid ground (that is, the decorative surface of the ground decoration material) is relatively large, resulting in a slow process of heat transfer to the indoor space

Third, once there are quality problems such as water leakage during use, it is impossible to find the problem point. Even if it is found, it will be very troublesome to repair. Adhesive materials and floor finishes, resulting in costly repairs

"First of all, there are many sizes and specifications of floor tiles, and the small ones are 30×30 cm. If coils are installed on floor tiles of this size, it will be more difficult to process, resulting in increased production costs; secondly, by other figure 2 It can be seen that the pipe joint part, that is, the connecting piece 5 in the manual, is exposed. When in use, it will be stepped on frequently, which will easily cause it to fall off or loosen, affecting normal use.

In addition, exposed pipe joints can also create obstacles for people to pass through

Third, if a layer of covering material is laid above the insulation layer of the floor tiles to cover it, it will not only affect the heat transfer efficiency, but also greatly increase the cost.

It can be seen from the above description that this kind of structure uses the round bamboo tube 5 as the heat pipe, which cannot realize standardized and industrialized large-scale production, and the bamboo tube itself is easy to degrade and crack when the climate is dry. Therefore, the heat storage and heat slow release composite floor The module has poor reliability and low safety, and requires frequent maintenance and repair after paving, and the cost of use is high

Secondly, the phase-change heat storage material 6 becomes viscous or liquid after absorbing heat, thus requiring the space filled with the phase-change heat storage material 6 to be airtight, that is, the end plate 4 and the thermal insulation bottom plate 1 themselves must use Hard waterproof material, the bamboo floor surface layer 2 and the round bamboo tube 5 must be sealed and waterproofed, and the end plate 4, the heat insulation bottom plate 1, the bamboo floor surface layer 2 and the round bamboo tube 5 must be airtightly connected , so the implementation is difficult, the production and processing are troublesome, and it is not convenient for industrial production

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