Packaging structure for recessed surface structure provided with controllable curvature, and manufacturing method thereof

Abstract

The invention brings forwards a packaging structure for a recessed surface structure provided with a controllable curvature, and a manufacturing method thereof. The method comprises: manufacturing tin protruding points on a silicon substrate and realizing the control over the curvature radii of the protruding points in accordance with the diameters and / or heights of the tin protruding points; photoetching metal leads on the surfaces of the tin protruding points; depositing medium materials; and enclosing the metal leads around the medium materials and releasing the substrate and the tin protruding points at last so as to prepare the packing structure. In the packaging structure manufactured through the method, the sidewall curvature of the recessed surface structure is controllable, the recessed surface diameter can be freely adjusted within a range from tens of microns to several millimeters, various non-planar packaging needs of a BSI, an MEMS, a WLP and the like can be met, and the packaging structure also has the advantage of good technology adaptability.

Description

technical field [0001] The invention relates to a chip package structure and a manufacturing method thereof, in particular to a package structure with a controllable curvature surface. Background technique [0002] In recent years, the design of electronic products has been moving towards light, thin, short, and small. When designing circuits, the concept of systemization has been incorporated, so that a single chip can have multiple functions. As far as electronic packaging technology is concerned , in order to meet the design trend of light, thin, short, and small, the concept of multi-chip module (MCM) packaging has also been developed, especially the three-dimensional (3D) packaging first breaks through the traditional concept of planar packaging, so that a single package can be stacked. One chip realizes the doubling of storage capacity, which is called stacked 3D packaging in the industry. The traditional packaging structure is packaged on a flat substrate, but with t...

AI Technical Summary

Problems solved by technology

The traditional packaging structure is packaged on a flat substrate, but with the development of chip technology, only packaging on a flat substrate can no longer meet the design requirements, such as BSI (rear projection image sensor), HB-LED (high brightness Light-emitting diodes) and some special MEMS (micro-electromechanical sensors) packages need to be packaged in a curved concave structure to achieve chip protection, improve device performance, and other functions, thus developing the concept of concave packaging

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