Lifting device, semiconductor chip production metal etching equipment and method

A lifting device and lifting mechanism technology, which is applied in semiconductor/solid-state device manufacturing, transportation and packaging, discharge tubes, etc., to improve the reliability of the action, eliminate lost steps, and maintain uniqueness

Inactive Publication Date: 2014-01-29
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a lifting device, which can improve the stability of the lifting mechanism ...

Method used

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  • Lifting device, semiconductor chip production metal etching equipment and method
  • Lifting device, semiconductor chip production metal etching equipment and method

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Embodiment Construction

[0038] In order to enable your examiners to have a further understanding and understanding of the purpose, features and effects of the present invention, the following detailed descriptions are as follows with the accompanying drawings.

[0039] Such as figure 1 As shown, the lifting device of the present invention includes a control unit 1, a solenoid valve 2, a cylinder 3, and an upper limit sensor 41 and a lower limit sensor 42; the cylinder 3 includes a piston 31 and a piston rod 32; its working principle is, The control unit 1 sends a voltage signal to the solenoid valve 2 to drive the solenoid valve 2 to act, thereby causing the piston 31 of the cylinder 3 to move upward or downward. When the upper limit sensor 41 or the lower limit sensor 42 detects that the piston 31 has moved in place, the The control unit 1 sends a feedback signal. Wherein the piston rod 32 can be connected with other components to drive the action.

[0040] Such as figure 2 As shown, the metal e...

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PUM

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Abstract

The invention discloses a lifting device which mainly comprises a control unit and a lifting mechanism. The control unit is used for transmitting control signals and receiving feedback signals; the lifting mechanism comprises an electromagnetic valve and an air cylinder and is used for receiving the control signals transmitted by the control unit and completing lifting. Limit sensors are respectively installed at two side ends of the air cylinder. When a piston of the air cylinder moves to the limit position, the feedback signals are transmitted to the control unit. The lifting device can effectively eliminate possible step losing of a step motor and gap errors caused by screw abrasion, so that silicon wafers can accurately reach the technical position and the transport position and are kept unique. Besides, heating, ageing of electric wires and potential hazards of fire disasters caused by driving the step motor by high driving current can be eliminated. The invention further discloses semiconductor chip production metal etching equipment utilizing the lifting device, and a silicon wafer processing method applying the etching equipment.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit manufacturing equipment, in particular to a lifting device; the invention also relates to a semiconductor chip production metal etching equipment using the lifting device and a method for silicon wafer process using the equipment. Background technique [0002] In the plasma degumming reaction chamber of metal etching equipment for semiconductor chip production, in order to raise and lower the position of the silicon wafer in the chamber to reach the height of the silicon wafer transport or the height of the process position, the operation of the silicon wafer lifting device must be accurate and stable. [0003] The structure of the existing lifting device is to tell the stepper motor driver through the host signal command, and the driver sends a signal to make the stepper motor rotate a certain number of steps, drive the screw to rotate, make the slider on the screw go up and down, and make the...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01J37/32
CPCH01L21/67259H01L21/68764
Inventor 夏志刚李顺义张骥
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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