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Undercoating layer for plating process, laminated board for wiring board and its manufacturing method, multilayer wiring board and its manufacturing method

一种底涂层、布线板的技术，应用在涂层、印刷电路制造、金属材料涂层工艺等方向，能够解决绝缘材料与铜粘接性不足等问题，达到高焊料耐热性、高粘接性的效果

Active Publication Date: 2015-10-14
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a buildup board made of this material is subjected to a 90° bending peel test, the adhesion between the insulating material and copper is insufficient.

Method used

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  • Undercoating layer for plating process, laminated board for wiring board and its manufacturing method, multilayer wiring board and its manufacturing method
  • Undercoating layer for plating process, laminated board for wiring board and its manufacturing method, multilayer wiring board and its manufacturing method
  • Undercoating layer for plating process, laminated board for wiring board and its manufacturing method, multilayer wiring board and its manufacturing method

Examples

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Effect test

Embodiment

[0120] Next, the present invention will be specifically described by way of examples, but the scope of the present invention is not limited to these examples.

[0121] [Preparation of resin varnish for undercoating in plating process]

preparation example 1

[0123] N,N-Dimethylacetamide (DMAc) was mixed with 0.75 g of phenolic hydroxyl group-containing polybutadiene-modified polyamide (manufactured by Nippon Kayaku Co., Ltd., trade name: BPAM-155) as component (C). After 6.75 g, add 10 g of biphenyl aralkyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name: NC-3000H) as (A) component, cresol novolak type phenolic resin (DIC) as (B) component Manufactured by the company, trade name: KA-1165) 4.1 g, and after adding 0.1 g of 2-phenylimidazole (manufactured by Shikoku Chemical Industry Co., Ltd., trade name: 2PZ) as a curing accelerator, use a mixed solvent containing DMAc and methyl ethyl ketone. It was diluted to obtain a resin varnish A for an undercoat layer for a plating process (solid content concentration: about 25% by mass).

preparation example 2

[0125] N,N-Dimethylacetamide (DMAc) was mixed with 1.5 g of phenolic hydroxyl group-containing polybutadiene-modified polyamide (manufactured by Nippon Kayaku Co., Ltd., trade name: BPAM-155) as component (C). After 13.5 g, add 10 g of biphenyl aralkyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name: NC-3000H) as (A) component, novolak type phenol resin (manufactured by DIC Corporation) as (B) component , trade name: TD-2090) 3.6g, 2-phenylimidazole (manufactured by Shikoku Chemical Industry Co., Ltd., trade name: 2PZ) 0.1g, fumed silica (manufactured by Japan AEROSIL Corporation, trade name) as a curing accelerator : R972) after 0.9 g, was diluted with a mixed solvent containing DMAc and methyl ethyl ketone (solid content concentration: about 25% by mass). Subsequently, a uniform resin varnish B for an undercoat layer for a plating process was obtained using a disperser (Nanomizer, trade name, manufactured by Yoshida Kikuyo Co., Ltd.).

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Abstract

The present invention provides an undercoat layer for a plating process, a laminated board for a wiring board having the undercoat layer and a method for producing the same, and a multilayer wiring board having the undercoat layer and a method for fabricating the same, which are used in the plating process. The undercoat layer is formed from a resin composition for an undercoat layer containing a polyfunctional epoxy resin (A), an epoxy resin curing agent (B), and a phenol-containing phenol having a predetermined structural unit The polybutadiene-modified polyamide resin (C) having a hydroxy group, and the compounding ratio of the (C) component is 5 parts by mass or more and less than 25 parts by mass with respect to 100 parts by mass of the total amount of the (A) component and the (B) component parts by mass.

Description

technical field [0001] The present invention relates to a primer layer for plating process, a laminated board for wiring boards having the primer layer and a manufacturing method thereof, and a multilayer wiring board having the primer layer and manufacturing thereof method. Background technique [0002] Multilayer wiring boards are generally produced by the following methods. That is, first, on an insulating substrate with inner layer circuits formed on one or both sides, a material (prepreg) obtained by impregnating glass cloth with epoxy resin and adjusted to a semi-cured state is laminated together with copper foil, Further, hot pressing is performed to perform lamination and integration. Subsequently, holes called through holes for interlayer connections are drilled. Electroless plating is performed on the inner wall of the through hole and the surface of the copper foil, and further electroplating is performed as needed to make the plating layer as a circuit conduct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/20H05K1/03H05K3/18
CPCH05K1/0373H05K2201/0209H05K3/4676C23C18/1844C25D5/34C25D7/0614C23C18/1653C09D5/002C08L63/00Y10T156/1043Y10T428/249921C09D163/00C23C18/20H05K1/03H05K3/18H05K1/0298H05K1/0366H05K3/007
Inventor 藤本大辅山田薰平小川信之村井曜
Owner RESONAC CORP
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