Method for chamfering wafer, apparatus for chamfering wafer, and jig for adjusting angle of grindstone

Abstract

The invention provides a method for chamfering a wafer, an apparatus for chamfering a wafer, and a jig for adjusting the angle of a grindstone. In the method for chamfering a wafer by using two groove-free grindstones, the time for reshaping (finishing) the groove-free grindstones is reduced. In addition, the contact length between the groove-free grindstones and a wafer is increased, and the time for hole shrinkage machining of the wafter and the time for machining the wafter into a wafer having a desired cross section profile are shortened. The method for chamfering a wafer includes loading a wafer (1) on a rotary bench in a centering manner and making the wafer rotate to enable two groove-free grindstones (3, 3) machining the rotary wafer to contact with the periphery (1a) of the wafer so as to chamfer the diameter or the cross section profile of the wafer (1). The method is characterized in that the above two groove-free grindstones (3, 3) are configured in a way that central lines (L, L) of the grindstones along the width are close to the side of the rotary axis (S) of the wafer (1) placed on the rotary bench, and are in contact with the wafer (1).

Description

technical field [0001] The present invention relates to a method and an apparatus for processing a wafer used as a material of a semiconductor device and a peripheral end portion of a wafer on which a semiconductor device is mounted. Background technique [0002] Disc-shaped thin plates used as substrates for integrated circuits such as various crystalline wafers and other semiconductor device wafers, and other disc-shaped thin plates formed of hard materials containing metal materials, such as silicon (Si) single crystal, gallium arsenide (GaAs), crystal, quartz, sapphire, ferrite, silicon carbide (SiC), etc. chamfering of disc-shaped thin plates (simply referred to as wafers) Among them, there is the following technical proposal, that is, in order to obtain the cross-sectional shape and the accuracy of the cross-sectional shape, processing is performed using a grooved forming grinder having a groove formed with a groove of the outer shape of the peripheral end of the wafer...

AI Technical Summary

Problems solved by technology

[0034] here, as Figure 22 As shown, since the centerlines L, L in the width direction of the contact end surfaces 4a, 4a of the cylinders of the two cup-shaped grooveless grinders 4, 4 are arranged in parallel, there is a problem that the contact with the wafer 1 The contact length becomes shorter, the chamfering process takes time, and the abrasive tool wears eccentrically

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