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High Frequency Circuit Module

A high-frequency circuit and high-frequency technology, applied in the direction of circuits, circuit devices, circuit heating devices, etc., can solve problems such as noise or leakage signal mixing, and achieve the effects of reducing power loss, shortening length, and reducing radiation noise

Active Publication Date: 2016-10-05
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the structure described in Patent Document 2, when confirming the information block of W-CDMA as the first communication method, although the W-PA-IC121 equivalent to the power amplifier IC is far away from the high frequency IC310, since the duplexer 100 is far away High-frequency IC 310, so there is a problem that in the received signal passing through the duplexer 100, noise or leakage signal generated by the power amplifier IC is mixed into the receiving circuit of the high-frequency IC

Method used

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Embodiment Construction

[0022] A high-frequency circuit module according to a first embodiment of the present invention will be described with reference to the drawings. figure 1 A schematic circuit diagram of a high-frequency circuit block is shown. In addition, in this embodiment, in order to simplify description, only the structure related to the summary of this invention is mainly demonstrated.

[0023] The high-frequency circuit module 100 of this embodiment is used in a mobile phone corresponding to two frequency bands. Such as figure 1 As shown, the high-frequency circuit module 100 has: a high-frequency switch 101, first to second duplexers 110, 120, high-frequency power amplifiers 151, 152 for transmission, and RFIC (Radio Frequency Integrated Circuit: radio frequency integrated circuit) 160 . In addition, in an actual circuit configuration, there are matching circuits, bandpass filters for transmission signals, and the like for each frequency band, but these are omitted in this embodimen...

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Abstract

The invention provides a high-frequency circuit module with high installation density. The high-frequency circuit module (100) has on the upper surface of the circuit substrate (200): an RFIC (160) for transmitting and receiving high-frequency signals; a power amplifier IC (155) for amplifying the transmission signal from the RFIC; and The duplexer (110) separates the transmission signal output from the power amplifier IC (155) to the antenna and the reception signal input from the antenna to the RFIC (160), and the duplexer (110) is arranged between the RFIC (160) and the power amplifier IC (155).

Description

technical field [0001] The present invention relates to a high-frequency circuit module in which a high-frequency IC, a power amplifier IC, and a duplexer are mounted on a circuit board, and particularly relates to an arrangement structure of each component. Background technique [0002] In recent years, multifunctional mobile phones and miniaturization have been achieved, represented by so-called multifunctional mobile phones called smartphones. In such a mobile phone, a high-frequency circuit module is mounted on a mother board. In the high-frequency circuit module, various components necessary for transmitting and receiving high-frequency signals are mounted on a circuit board (for example, refer to Patent Document 1). . The high-frequency circuit module described in Patent Document 1 includes, on a circuit board, a high-frequency IC that performs transmission and reception processing of high-frequency signals, a power amplifier IC that amplifies the power of a transmiss...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18
CPCH04B1/0057H01L2224/16225H01L23/3735H05K1/0207H05K1/0216H05K1/0237H03H7/463H03H9/0547H03H9/08H04L5/1461
Inventor 中村浩五十岚智宏
Owner TAIYO YUDEN KK