A kind of preparation method of Sn-bi brittle alloy preform solder

A technology of solder preforms and brittle alloys, applied in welding equipment, metal processing equipment, welding media, etc., can solve the problems of brittleness and difficult processing of tin-bismuth solder, and achieve excellent welding performance, high production efficiency, and shape complete and precise effect

Active Publication Date: 2016-05-18
GUANGZHOU XIANYI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a preparation method of Sn-Bi brittle alloy solder preform, which can effectively solve the problem that tin-bismuth solder is brittle and difficult to be processed into foil strips

Method used

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Examples

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Effect test

preparation example Construction

[0020] A kind of Sn-Bi alloy solder preform preparation method of the present invention comprises the following steps:

[0021] (1) Prepare the Sn-Bi raw materials with a mass percentage of 42:58.

[0022] (2) Melting and casting, setting the resistance furnace, crucible, casting mold and quartz rod in the vacuum glove box, wherein the furnace temperature control cabinet of the resistance furnace is placed outside the vacuum glove box, and the resistance furnace, crucible, casting mold, quartz rod Rod and vacuum glove box constitute a protective pre-alloying system;

[0023] Put the prepared raw materials in the above step (1) into the configured protective pre-alloying system;

[0024] Start the vacuum pump to evacuate until the pressure is -0.1MPa or below -0.1MPa, then stop the vacuum pump; fill with N2 gas to atmospheric pressure;

[0025] Start the resistance furnace, and set the pre-alloying temperature through the furnace temperature control cabinet, the pre-alloying ...

Embodiment 1

[0032] The preparation method of Sn-Bi alloy solder preform is as follows:

[0033] (1) Mix the raw materials of 0.058Kg pure bismuth and 0.042Kg pure tin.

[0034] (2) Set the resistance furnace, crucible, casting mold and quartz rod in the vacuum glove box, wherein the furnace temperature control cabinet of the resistance furnace is placed outside the vacuum glove box, and the resistance furnace, crucible, casting mold, quartz rod and The vacuum glove box constitutes a protective pre-alloying system;

[0035] Put the prepared raw materials in the above step (1) into the configured protective pre-alloying system;

[0036] Start the vacuum pump to evacuate until the pressure is -0.1MPa or below -0.1MPa, then stop the vacuum pump and fill it with N2 gas to atmospheric pressure;

[0037] Put the raw materials obtained in the above step (1) into the crucible of the vacuum glove box, start the resistance furnace, set the pre-alloying temperature through the furnace temperature c...

Embodiment 2

[0045] The preparation method of Sn-Bi alloy solder preform is as follows:

[0046] (1) Prepare the raw materials of 0.058Kg pure bismuth and 0.042Kg pure tin;

[0047] (2) Set the resistance furnace, crucible, casting mold and quartz rod in the vacuum glove box, wherein the furnace temperature control cabinet of the resistance furnace is placed outside the vacuum glove box, and the resistance furnace, crucible, casting mold, quartz rod and The vacuum glove box constitutes a protective pre-alloying system;

[0048] Put the prepared raw materials in the above step (1) into the configured protective pre-alloying system;

[0049] Start the vacuum pump to evacuate until the pressure is -0.1MPa or below -0.1MPa, then stop the vacuum pump and fill it with N2 gas to atmospheric pressure;

[0050] Put the raw materials obtained in the above step (1) into the crucible of the vacuum glove box, start the resistance furnace, set the pre-alloying temperature through the furnace temperatu...

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Abstract

The invention discloses a preparation method of a Sn-Bi brittle alloy preformed welding sheet, which comprises the steps of batching, melting and casting, hot rolling, punching and the like. According to the preparation method of the Sn-Bi brittle alloy preform soldering sheet of the present invention, the processed tin-bismuth soldering sheet has precise composition, complete and precise shape, and excellent welding performance. The process is simplified, the production cost is more reasonable, and the production efficiency is higher. Solder tabs of different sizes and shapes can be produced according to different needs.

Description

technical field [0001] The invention relates to the field of microelectronic welding technology, in particular to a preparation method of a Sn-Bi brittle alloy preformed solder sheet. Background technique [0002] Due to the problem of environmental pollution in lead-containing electronic products, more and more countries have begun to pay attention to the development and research of lead-free electronic solder. At present, the commonly used lead-free solder series include tin-silver, tin-copper, tin-zinc and tin-bismuth, etc. Among them, tin-bismuth solder has good mechanical properties, strong creep resistance, cheap price, and its melting point is close to that of tin-lead solder. , and has been widely used. [0003] However, as the size of electronic components becomes smaller and smaller, tin-bismuth solder has a greater market prospect as a solder preform. However, due to the particularly brittleness of tin-bismuth solder, these forms of wire or sheet are difficult t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/40
CPCB23K35/264B23K35/40B23K2101/36
Inventor 陈卫民
Owner GUANGZHOU XIANYI ELECTRONICS TECH
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