Nanoparticle-reinforced copper-based composite material and preparation method thereof

A technology of copper-based composite materials and nanoparticles, applied in the direction of nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of poor mechanical properties, long cycle, high cost, etc., and achieve low cost and time Long, easily controlled effects

Active Publication Date: 2016-01-20
嘉兴市燕知网络科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Similarly, this process also has the disadvantages of poor mechanical properties, many processes, and high cost.
In short, there are many processes, long cycle times and high costs in the preparation of nano-dispersion strengthened copper matrix composites.

Method used

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  • Nanoparticle-reinforced copper-based composite material and preparation method thereof
  • Nanoparticle-reinforced copper-based composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Put the copper ingot and the graphite ingot into the crucible, and put 200g molybdenum on top of the graphite ingot, and 5g CaF on top of the copper ingot 2 ;Close the vacuum chamber and start vacuuming; start the rotating device to rotate the substrate at a speed of 6rpm, and turn on the substrate heating device to heat the substrate temperature to stabilize it at 650°C; when the vacuum degree reaches 3×10 -2 At Pa, open the baffle and electron gun, and deposit the isolation layer CaF 2 ;Heat the copper ingot with a beam size of 1.5A, heat the graphite ingot with a beam size of 1.5A, and start to deposit materials. After 50 minutes of deposition, turn off the electron gun, pull up the baffle, turn off the heating device, and turn off the substrate rotation device; when the substrate When the temperature drops below 200°C, turn off the vacuum system, remove the substrate, and separate to obtain a plate with a thickness of 0.26mm and a diameter of 520mm. The composition...

Embodiment 2

[0027] Put the copper ingot, molybdenum ingot and anthracene powder into the crucible respectively, and put 5g CaF on the copper ingot 2 ;Close the vacuum chamber and start vacuuming; start the rotating device to rotate the substrate at a speed of 15rpm, and turn on the substrate heating device to heat the substrate temperature to stabilize it at 750°C; when the vacuum degree reaches 3×10 -2 At Pa, open the baffle and electron gun, and deposit the isolation layer CaF 2 ;Heat the copper ingot with a beam size of 2.2A, heat the molybdenum ingot with a beam size of 2.6A, heat the anthracene powder with a beam size of 0.6A, and start depositing materials. After 30 minutes of deposition, turn off the electron gun and pull up the baffle. Turn off the heating device, turn off the substrate rotation device; when the substrate temperature drops below 200°C, turn off the vacuum system, remove the substrate, and separate to obtain a plate with a thickness of 0.3mm and a diameter of 520mm...

Embodiment 3

[0029] Put the copper ingot, molybdenum ingot and anthracene powder into the crucible respectively, and put 5g ZrO on the copper ingot 2 ;Close the vacuum chamber and start vacuuming; start the rotating device to rotate the substrate at a speed of 8rpm, and turn on the substrate heating device to heat the substrate temperature to stabilize it at 650°C; when the vacuum degree reaches 3×10 -2 At Pa, open the baffle and electron gun, and deposit the isolation layer ZrO 2 ;Heat the copper ingot with a beam size of 2.2A, heat the molybdenum ingot with a beam size of 2.0A, heat the anthracene powder with a beam size of 1A, and start to deposit materials. After 40 minutes of deposition, turn off the electron gun, pull up the baffle, and close Heating device, turn off the substrate rotation device; when the temperature of the substrate drops below 200°C, turn off the vacuum system, remove the substrate, and separate to obtain a plate with a thickness of 0.38mm and a diameter of 520mm....

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Abstract

The invention discloses a nano-particle reinforced copper-based composite material and a preparation method thereof. The size of a copper matrix grain is smaller than 20 microns in the copper-based composite material; the nano-particle reinforced phase is molybdenum carbide, or molybdenum carbide and molybdenum, or molybdenum carbide and carbon; the particle size of the nano-particle reinforced phase is smaller than 200nm; the mass percent of Mo in the copper-based composite material is 0.1-15%; the mass percent of C is smaller than 1%. The nano-particle reinforced copper-based composite material disclosed by the invention is prepared by adopting an electronic beam physical vapor deposition process. The nano-particle reinforced copper-molybdenum-carbon composite material prepared by the method has excellent mechanical property and electrical property, and adopted electronic beam physical vapor deposition process is simple, low in cost and easy to control.

Description

technical field [0001] The invention relates to a copper-based composite material reinforced by nanoparticles and a preparation method thereof, in particular to a copper-molybdenum-carbon composite material reinforced by nanoparticles and a preparation method thereof. Background technique [0002] Copper and copper alloy materials are important non-ferrous metal materials, which have been widely used in the electronics industry and other fields due to their excellent physical and mechanical properties. However, with the rapid development of science and technology (especially the rapid development of the microelectronics industry), traditional copper and its alloys cannot meet the requirements due to the inability to balance electrical properties and strength. Nano-dispersion-strengthened copper alloy is a new type of composite material with nanoparticles as the second phase. Because nanoparticles can effectively hinder dislocation movement and grain boundary slip, the mechan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C1/02B82Y40/00B82Y30/00
Inventor 李晓宋广平卜凡雨徐斌楼白杨
Owner 嘉兴市燕知网络科技有限公司
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