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Copper powder surface activity activating technology in copper steel bimetal powder sintering

A surface-active, bimetallic technology, applied in the field of powder metallurgy sintering, can solve the problem of weak bonding strength between copper alloy and steel back, and achieve the effect of reducing activation energy and enhancing bonding strength

Active Publication Date: 2015-05-27
龙工(上海)精工液压有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The technical problem to be solved by the present invention is to provide a copper powder surface active activation process in the copper-steel bimetallic powder sintering that can enhance the bonding strength of the copper alloy and the steel back, and solve the problem of copper powder produced by the traditional bimetallic sintering process. Technical problem of weak bonding strength between alloy and steel back

Method used

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  • Copper powder surface activity activating technology in copper steel bimetal powder sintering
  • Copper powder surface activity activating technology in copper steel bimetal powder sintering

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] 1. Preparation before sintering

[0039] 1.1 Raw material and ratio:

[0040] Copper 80wt%, tin 10wt%, lead 10wt%.

[0041] 1.2 Mixing parameters:

[0042] First mix copper powder and tin powder for one hour, then add lead powder and mix for one hour.

[0043] 1.3 Arrange corundum rings on the burning boat, put the steel back after cyanide copper plating into the corundum ring, loosely spread powder until the steel back is covered, and press firmly. Here, the initial firing is not to obtain a dense structure, but to obtain a higher binding force.

[0044] 2 Activate the copper powder surface activity of the product

[0045] 2.1 Put the copper-steel bimetallic powder sintered sample in the furnace, and heat it from room temperature to 260°C at a rate of 6°C / min without protective gas;

[0046] 2.2 Start to feed nitrogen into the furnace, the flow rate is 200L / h, and keep warm for 20 minutes;

[0047] 2.3 After the heat preservation is over, the temperature is raise...

Embodiment 2

[0055] 1. Preparation before sintering

[0056] Same as step 1 in Example 1.

[0057] 2 Activate the copper powder surface activity of the product

[0058] 2.1 Put the copper-steel bimetallic powder sintered sample in the furnace, and heat it from room temperature to 300°C at a rate of 6°C / min without protective gas;

[0059] 2.2 Start to feed nitrogen into the furnace, the flow rate is 200L / h, and keep warm for 30 minutes;

[0060] 2.3 After the heat preservation is over, the temperature is raised to 450°C, and the heating rate is 4°C / min;

[0061] 2.4 Continue heating and feed hydrogen gas at a flow rate of 80L / h. After 30 minutes, the nitrogen flow rate is reduced to 140L / h. At the same time, heat to 850°C with a heating rate of 4°C / min;

[0062] 2.5 After 30 minutes of heat preservation, the furnace is cooled to room temperature under a protective atmosphere.

[0063] 2.6 After the sample is taken out, the re-compression and re-firing process is carried out. The re-fir...

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Abstract

The invention discloses a copper powder surface activity activating technology in copper steel bimetal powder sintering. The copper powder surface activity activating technology in copper steel bimetal powder sintering comprises the following steps that a copper steel bimetal powder sintering sample is placed in a furnace; the sample is heated from the indoor temperature to 260-300 DEG C at the rate of 6 DEG C / min without shielding gas; nitrogen is fed into the furnace, wherein the flow speed is 200 L / h, and the temperature is kept for 20-30min; after the temperature keeping is completed, the temperature rises to 420-450 DEG C, and the heating rate is 4 DEG C / min; heating continues, hydrogen is fed into the furnace, the flow speed is 80 L / h and the flow speed of the nitrogen decreases to 140 L / h after 30min, at the same time, the temperature rises to 800-850 DEG C, and the heating rate is 4 DEG C / min; after the temperature is kept for 20-30min, the furnace is cooled to be at the indoor temperature at the protective atmosphere. By means of the copper powder surface activity activating technology in copper steel bimetal powder sintering, the surface activity of copper powder can be better activated, the activation energy of action is reduced, the copper powder can be better bonded with a steel backing in the following heating stage, and the bonding strength between copper alloy and the steel backing is enhanced.

Description

technical field [0001] The invention relates to a powder sintering process, in particular to a copper powder surface active activation process in copper-steel bimetallic powder sintering, which belongs to the technical field of powder metallurgy sintering. Background technique [0002] The problem of material wear plays a pivotal role in the development of the national economy. It is of great significance to use the knowledge of tribology to develop new wear-resistant materials and take necessary technologies and measures to reduce the wear loss of materials as much as possible. The high-strength, low-friction, and wear-resistant copper alloy functional material that can be used in a wide temperature range is produced by advanced powder metallurgy technology. It is widely used in plunger pumps for automobiles, especially construction machinery. The wear-resistant copper alloy layer can solve the problems of strength and wear resistance at the same time, and save a lot of pre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/00B22F7/08
Inventor 王永兴何臣武刘俊
Owner 龙工(上海)精工液压有限公司