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Epoxy latent curing agent and corresponding epoxy resin coating

A technology of latent curing agent and epoxy resin coating, applied in the direction of epoxy resin coating, coating, etc., can solve the problems of unfavorable production of composite materials, poor compatibility of solvents, long curing time, etc., and achieve short curing time, Short curing time and good curing performance

Inactive Publication Date: 2014-03-26
昆山珍实复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when dicyandiamide is used alone as a curing agent, the curing temperature exceeds 170 ° C, and the compatibility with epoxy resin and low-boiling solvents is not good, which is not conducive to the production of composite materials.
[0003] The advantages of one-component coatings formulated with dicyandiamide are good mechanical properties and stability, and long storage time, but the curing temperature is high and the curing time is long, which is the same problem that needs to be solved

Method used

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  • Epoxy latent curing agent and corresponding epoxy resin coating
  • Epoxy latent curing agent and corresponding epoxy resin coating
  • Epoxy latent curing agent and corresponding epoxy resin coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The epoxy resin latent curing agent includes the following components in parts by weight: 80 dicyandiamide, 30 urea, 40 silicon dioxide, 10 asbestos fibers, and 10 polyglycidyl ethers.

[0018] In this embodiment, the function of urea is to lower the curing temperature of the curing agent and shorten the curing time. The function of the above-mentioned diluent polyglycidyl ether is to reduce the viscosity.

Embodiment 2

[0020] The epoxy resin latent curing agent includes the following components in parts by weight: 90 parts by weight of dicyandiamide, 50 parts by 1,1-dimethylurea, 40~60 parts of silicon dioxide, 10~30 parts of asbestos fiber, 10~20 parts of acetone,

[0021] In this embodiment, the function of 1,1-dimethylurea is to lower the curing temperature of the curing agent and shorten the curing time. The function of the above-mentioned diluent acetone is to reduce the viscosity.

Embodiment 3

[0023] A kind of epoxy resin paint, every 100 parts of water comprises the following composition by mass percentage: epoxy resin 40%, curing agent 15%, pigment 10%, defoamer 15%, thickener 10%, leveling agent 10%.

[0024] The curing agent is the epoxy resin latent curing agent obtained in Example 1, and its curing temperature is low and the curing time is short. The thickener is methylcellulose. The leveling agent is an acrylic leveling agent.

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Abstract

The invention discloses an epoxy latent curing agent and a coating thereof. The epoxy latent curing agent comprises the following components in parts by weight: 80-90 parts of dicyandiamide, 30-50 parts of urea derivatives, 40-60 parts of silicon dioxide, 10-30 parts of asbestos fiber and 10-20 parts of diluent. The epoxy resin coating comprises 40-55% of epoxy resin, 10-20% of the epoxy latent curing agent, 10-20% of pigments, 5-15% of defoamer, 5-15% of diluent and 5-15% of flatting agent. The epoxy latent curing agent disclosed by the invention is good in curing performance, low in curing temperature, good in storage stability, strong in adaptability and wide in using performance. The epoxy resin coating is low in viscosity, short in curing time, low in curing temperature, flat, smooth, uniform, convenient to use and good in storage stability.

Description

Technical field: [0001] The invention relates to the technical field of curing agents and the paint industry, in particular to an epoxy resin latent curing agent and epoxy resin coatings thereof. Background technique: [0002] At room temperature, the latent curing agent in epoxy resin can be stored for a long time, and the curing reaction occurs under conditions such as heating. Among them, the latent curing agent for epoxy resin is dicyandiamide. It is dispersed in epoxy resin, has good stability, and the pot life at room temperature can reach more than 6 months, and the cured product has good performance. However, when dicyandiamide is used alone as a curing agent, the curing temperature exceeds 170°C, and the compatibility with epoxy resin and low-boiling solvents is not good, which is not conducive to making composite materials. [0003] The advantages of one-component coatings formulated with dicyandiamide are good mechanical properties and stability, and long storag...

Claims

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Application Information

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IPC IPC(8): C08G59/40C08G59/50C09D163/00C09D7/12
Inventor 黄文成
Owner 昆山珍实复合材料有限公司
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