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Semi-aromatic polyamide and preparation method thereof, and semi-aromatic polyamide composition and application thereof

A semi-aromatic and polyamide technology, applied in the field of polyamide, can solve the problems of polyamide shrinkage, high water absorption, and easy warping of processed parts, and achieve good warping resistance and glass transition temperature High, good fluidity effect

Active Publication Date: 2014-03-26
KINGFA SCI & TECH CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But it also has the disadvantage of high water absorption
Although PA10T solves the shortcoming of high water absorption, the high crystallinity makes polyamide have a large shrinkage rate during the molding process, and the processed parts are also easy to warp and deform, so it is limited in the production of high dimensional stability requirements. pieces
In addition, its low glass transition temperature also limits its use temperature

Method used

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  • Semi-aromatic polyamide and preparation method thereof, and semi-aromatic polyamide composition and application thereof
  • Semi-aromatic polyamide and preparation method thereof, and semi-aromatic polyamide composition and application thereof
  • Semi-aromatic polyamide and preparation method thereof, and semi-aromatic polyamide composition and application thereof

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preparation example Construction

[0032] The preparation method of the semi-aromatic polyamide composition of the present invention is: according to adding 0.1-30 other additives according to 25-60 polyamide, carry out pre-mixing to obtain the premix and add the twin-screw extruder from the main feeding port, 40- 75 Inorganic reinforcing filler was added through side feeding, the mixture was melted and mixed at a screw speed of 300RPM, and the temperature of the screw barrel was 260-300°C, after the molten mixture left the extruder, it was water-cooled and granulated to obtain a polyamide composition.

[0033] An application of the semi-aromatic polyamide composition as described above, the composition is applied in the field of electronics and electricity.

[0034] The substances used in the embodiments of the present invention are all commercially available substances.

[0035] The test methods of the various performances of the above-mentioned polyamides are as follows:

[0036] Melting point, glass transi...

Embodiment 1

[0052]Add 2492g (15mol) of terephthalic acid, 1810g (10.5mol) of 1,10-decanediamine, 947g (4.5mol) of PACM, 73g (0.6mol) of benzoic acid, 5g of sodium hypophosphite, and 2.5 liters of deionized water. The reaction kettle was heated up after deoxygenation-nitrogen flushing cycle twice, and started stirring when it reached 90°C; then continued to heat up under stirring until the temperature inside the kettle rose to 220°C. The reaction was continued at 220°C and 2 MPa for 2 hours by removing part of the water. After the reaction is completed, the material is discharged to obtain a prepolymer. The prepolymer was vacuum-dried at 80°C for 24 hours, and then solid-phase polymerized at 220°C for 10 hours under a nitrogen stream to obtain the final resin, and the melting point, heat of fusion, crystallinity and glass transition temperature of the resin were measured; and measured Its intrinsic viscosity, the test results are listed in Table 1.1. The obtained polyamide is prepared t...

Embodiment 2

[0054] Add 2492g (15mol) of terephthalic acid, 1810g (10.5mol) of 1,10-decanediamine, 1073g (4.5mol) of MACM, 73g (0.6mol) of benzoic acid, 5g of sodium hypophosphite, and 2.5 liters of deionized water. The reaction kettle was heated up after deoxygenation-nitrogen flushing cycle twice, and started stirring when it reached 90°C; then continued to heat up under stirring until the temperature inside the kettle rose to 220°C. The reaction was continued at 220°C and 2 MPa for 2 hours by removing part of the water. After the reaction is completed, the material is discharged to obtain a prepolymer. The prepolymer was vacuum-dried at 80°C for 24 hours, and then solid-phase polymerized at 220°C for 10 hours under a nitrogen stream to obtain the final resin. The melting point, heat of fusion, crystallinity and glass transition temperature of the resin were measured; and measured Its intrinsic viscosity, the test results are listed in Table 1.1. The obtained polyamide is prepared the...

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Abstract

The invention discloses semi-aromatic polyamide and a preparation method thereof, and a semi-aromatic polyamide composition and application thereof. The semi-aromatic polyamide is prepared from an aromatic dicarboxylic acid monomer and a diamine monomer, wherein the diamine monomer comprises aliphatic diamines and alicyclic diamines; and the sum of moles of the alicyclic diamines accounts for 25-35% of the diamine monomer. The semi-aromatic polyamide disclosed by the invention is low in crystallinity and high in glass transition temperature. The polyamide composition disclosed by the invention has relatively favorable buckling resistance, and can be widely used in the field of electronic and electric appliances.

Description

technical field [0001] The invention relates to the field of polyamides, in particular to a semi-aromatic polyamide, its preparation method, its composition and its application. Background technique [0002] Semi-aromatic polyamides, such as PA6T and PA9T, have been widely used in electronic appliances and motor vehicles due to their excellent mechanical strength, heat resistance, chemical resistance, wear resistance and self-lubrication, and low friction coefficient. Accessories and other fields. But it also has the disadvantage of high water absorption. Although PA10T solves the shortcoming of high water absorption, the high crystallinity makes polyamide have a large shrinkage rate during the molding process, and the processed parts are also easy to warp and deform, so it is limited in the production of high dimensional stability requirements. pieces. In addition, its lower glass transition temperature also limits its use temperature. [0003] Therefore, it is necessar...

Claims

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Application Information

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IPC IPC(8): C08G69/26C08G69/28C08L77/06
Inventor 肖中鹏蔡彤旻宁凯军许柏荣曹民曾祥斌姜苏俊吴博
Owner KINGFA SCI & TECH CO LTD
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