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Organic silicon gel composition for high-power LED (light-emitting diode) packaging

A technology of LED packaging and composition, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as small adhesion, cracking, and large adhesion, achieve excellent heat and oxygen aging resistance, and improve light extraction efficiency , the effect of high adhesive performance

Inactive Publication Date: 2014-03-26
BEIJING INSTITUTE OF PETROCHEMICAL TECHNOLOGY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a silicone gel composition for high-power LED packaging, which has a high refractive index and strong adhesive force, thereby solving the problem of low refractive index and high adhesion of existing silicone materials for high-power LED packaging. The problem of cracking due to small knot strength

Method used

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  • Organic silicon gel composition for high-power LED (light-emitting diode) packaging
  • Organic silicon gel composition for high-power LED (light-emitting diode) packaging
  • Organic silicon gel composition for high-power LED (light-emitting diode) packaging

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Embodiment 1 to 3

[0037]The formula of embodiment 1 to 3 is shown in Table 2, specifically as follows:

[0038] The formula of table 2 embodiment 1 to 3 (the consumption of raw material is percentage by weight in each embodiment)

[0039]

[0040]

[0041] The performance of embodiment 1 to 3 and comparative example is shown in table 3, specifically as follows:

[0042] The performance of table 3 comparative example and embodiment

[0043]

[0044] The comparative example in Table 3: it is the same type of silicone gel that is commercially available.

[0045] It can be seen from Table 3 that the silicone gel material of the embodiment of the present invention has a relatively high refractive index and light transmittance, has a strong adhesion to the PPA support, and has excellent heat and oxygen aging resistance, and is especially suitable for white light. The preparation of fluorescent powder for LED packaging, so as to improve the light extraction efficiency of LED for lighting. ...

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Abstract

The invention discloses an organic silicon gel composition for high-power LED (light-emitting diode) packaging, belonging to the field of gel for electronic products. The composition is composed of a component A and a component B, wherein the mass ratio of the component A to the component B is 1:1 when the two components are used and mixed; the component A comprises the raw materials in percentage by weight: 83-94% of vinyl methylphenyl silicone oil, 5-10% of vinylphenyl T resin, 0.5-5% of organic silicon epoxy resin, 0.2-2% of releasing agent and 50-500ppm of platinum catalyst; and the component B comprises the raw materials in percentage by weight: 96-99% of methylphenyl hydrogen-containing silicone oil, 0.1-1% of antioxidant, 0.1-2% of silane coupling agent, 0.001-0.1% of inhibitor and 0.1-1% of rheology modifier. In use, the component A and the component B are mixed at 25-50 DEG C and need to be used up within 6 hours. The composition is used for packaging of high-power LEDs for illumination, and is suitable for preparation of fluorescent powder in white light LED packaging.

Description

technical field [0001] The invention relates to the field of gel compositions for electronic products, in particular to a silicone gel composition for encapsulating high-power LEDs. Background technique [0002] At present, lighting accounts for about 20% of the world's total energy consumption. If the traditional light sources with low energy consumption, long life, safety and environmental protection are replaced by low-efficiency and high-power-consumption traditional light sources, it will undoubtedly bring about a worldwide lighting revolution, which is of great strategic significance to the sustainable development of our country. . Semiconductor lighting technology is one of the most promising high-tech fields in the 21st century. With the rise of the third-generation semiconductor represented by gallium nitride, white light LEDs have achieved mass production. The power consumption of high-brightness white LEDs is only 1 / 10 of traditional light sources, and has the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/05C08L83/07C08L63/00H01L33/56
Inventor 杨明山闫冉颜宇宏刘洋
Owner BEIJING INSTITUTE OF PETROCHEMICAL TECHNOLOGY
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