Printed semiconductor device and manufacturing method

Abstract

The invention discloses a printed semiconductor device and a manufacturing method thereof. The semiconductor device comprises: a substrate, a conductive metal ink, a semiconductor ink and an insulating ink, and the conductive metal ink contains 0.1wt% to 10wt% by mass of a low melting point liquid metal oxide and 0wt% to 90wt% conductive nanoparticles or semiconductor nanoparticles, the semiconductor ink contains 0.1wt% to 90wt% mass percentage of P-type or N-type semiconductor nanoparticles and organic matter, or the semiconductor ink contains 0.1wt% %~90wt% by weight of P-type or N-type semiconductor nanoparticles and polymers, the insulating ink contains organic matter or polymers. The printed semiconductor device and manufacturing method provided by the present invention can directly print low-melting-point metal inks and nanocomposites thereof that are liquid at around room temperature or at higher temperatures. Depending on the type of ink selected, various types of semiconductors can be realized. Direct printing of devices, including on-chip diodes, triodes, transistors, LEDs, lasers, etc.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to a printed semiconductor device and a manufacturing method. Background technique [0002] Semiconductor materials are materials between conductors and insulators, and devices made from them, such as semiconductor diodes, triodes, field effect transistors, and thyristors, have extremely wide and key applications in a large number of electronic industry fields. For this reason, the manufacture around semiconductor devices has always been at the core of research in the field of electronics industry. As the name implies, a semiconductor is generally composed of a conductive part, a semiconductor part and an insulating part according to a certain structure. So far, the processing of semiconductor devices has been carried out with a very complicated manufacturing process. The procedures are quite complicated, the energy consumption is high, the pollution is serious, and t...

AI Technical Summary

Problems solved by technology

However, a semiconductor device involves components such as conductors, semiconductors, and insulators. The existing technology is still difficult to ensure that all devices can be realized by direct printing. For example, even if organic semiconductor materials or insulating materials can be printed by spraying, the conductor part Printing is always a bottleneck

We know that conductors are generally metals such as copper, aluminum, etc., which have extremely high melting points. To achieve printing, they must first be melted and sprayed at extremely high temperatures, which obviously affects the low-melting point organic semiconductor materials on the device and even Substrate damage, therefore, this printing route is less likely to be achieved

For this reason, people propose organic or polymer conductor materials, but the conductivity of such materials is generally poor, and there are certain problems in solubilization and printability; Adding highly conductive nanoparticles to the polymer to achieve printable ink, but the actual manufacturing process needs to be printed first, and then undergo a certain chemical reaction and even sintering of this type of ink through a high temperature of more than hundreds of degrees, in order to finally deposit the required ink. conductor parts, so the whole procedure is still quite complicated

In short, so far, the domestic and foreign industries have not yet established a fast and simple semiconductor device that can be completely directly printed and directly formed and its manufacturing method.

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