Graphite heat-conducting adhesive tape

Abstract

The invention discloses a graphite heat-dissipation adhesive tape which comprises a heat-conducting adhesive layer, wherein the heat-conducting adhesive layer is prepared by mixing and baking the following components in parts by weight: 100 parts of acrylate adhesive, 100-145 parts of graphite powder, 200-220 parts of solvent, 0.6-0.8 part of curing agent and 0.06-0.07 part of coupling agent. The acrylate adhesive is composed of the following components in parts by weight: 100 parts of butyl acrylate, 0.4-0.6 part of benzoperoxide, 80-90 parts of 2-ethylhexyl acrylate, 2-2.5 parts of acrylic acid, 10-12 parts of methyl methacrylate, 3 parts of vinyl acetate and 0.5-0.6 part of 2-hydroxyethyl methacrylate. The thickness ratio of the PET (polyethylene terephthalate) to the heat-conducting adhesive layer to the aluminum foil layer is 100:(200-250):(20-50); and the diameter of the graphite powder is 3-6 micrometers. The adhesive tape enhances the heat conductivity in the length and thickness directions, implements the uniformity of the heat conductivity of the adhesive tape, is beneficial to heat dissipation to avoid local overheating of the adhesive tape, and improves the properties and service life of the product.

Description

technical field [0001] The invention relates to a graphite heat-conducting adhesive tape, which belongs to the technical field of adhesive materials. Background technique [0002] With the rapid development of the electronics industry, from ordinary desktop computers to notebook computers, tablet computers, and smart phones, technological innovation is advancing by leaps and bounds. Electronic products are becoming more portable, smaller in size, and more powerful in function, which leads to higher integration. This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components. However, the fan-type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise. Then there are other heat dissipation materials, such as copper foil and aluminum foil, but due to limited resources and high prices, the heat dissipation effect is not as good as expected....

AI Technical Summary

Problems solved by technology

This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components.

However, the fan type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise.

In turn, other heat dissipation materials have been produced, such as copper foil and aluminum foil heat dissipation. However, due to limited resources and high prices, the heat dissipation effect is not as good as imagined. Slowly, they are all looking for new and efficient heat dissipation materials.

Secondly, due to the diversity of electronic products, existing products often need to be customized, which makes it difficult to apply to specific use occasions and limits its application promotion; therefore, if a high-performance heat dissipation tape is designed for the characteristics of electronic products, it will become The direction of efforts of those of ordinary skill in the art

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