Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper

A lead-free solder and soldering technology, applied in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of high melting point, poor wettability of aluminum substrates, and poor mechanical properties of brazing joints. Achieve the effect of increasing the degree of dissolution, improving the oxidation resistance, and reducing the effect of oxidation and ablation

Active Publication Date: 2014-04-23
DALIAN UNIV OF TECH
View PDF8 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide Sn-Zn-Bi for aluminum-copper soldering to solve the problems of high melting point of existing solder (brazing solder), poor wettability on aluminum substrates and poor mechanical properties of brazed joints. lead-free solder alloy, which can directly braze aluminum-copper dissimilar metals by using the soft soldering method with a lower process temperature. Forms a stronger bond for a high reliability aluminum-copper solder joint

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper
  • Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper
  • Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Each component is calculated by weight percentage: Zn11%, Bi34%, Al0.01%, and the balance is Sn.

[0026] The preparation method of solder is as follows:

[0027] (1) The preparation of the lead-free solder alloy is to use the metal Sn with a purity of 99.99%, the metal Zn with a purity of 99.99%, the metal Bi with a purity of 99.99%, the metal Al with a purity of 99.99%, and the metal with a purity of 99.99%. Ni, proportioning the components of the solder alloy by weight percentage, a total of 100g, is placed in the high temperature resistant tube;

[0028] (2) Use a hydrogen flame to melt and seal one end of the high-temperature resistant tube, melt the other end into a thin mouth and use a vacuum pump to vacuumize, and after the air in the pipe is exhausted, melt and seal the thin mouth;

[0029] (3) Put the high-temperature-resistant tube in a resistance furnace, heat it to 650°C and melt it. After all the components are melted, keep it warm for 2-3 hours to homoge...

Embodiment 2

[0031] Each component is calculated by weight percentage: Zn12%, Bi28%, Al0.1%, and the balance is Sn. Alloy preparation method is the same as embodiment 1.

Embodiment 3

[0033] Each component by weight percentage is: Zn 15%, Bi 25%, Al 0.4%, P 0.1%, and the balance is Sn. Alloy preparation method is the same as embodiment 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper and belongs to the technical field of new material. The solder alloy comprises, by weight, 11-35% of Zn, 16-34% of Bi, 0.01-2% of one or both of Al and Ni or 0.01-0.5% of one or both of P and RE, and rest of Sn. The solder alloy has excellent wettability on both aluminum baseboard and copper baseboard and can be well combined with an aluminum interface and a copper interface, and accordingly the soldered joint has excellent mechanical property; such dissimilar metals as aluminum and copper can be soldered directly, and the Sn-Zn-Bi-base lead-free solder alloy can also be used for the soldering between aluminum and aluminum; the Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper is simple in technique, is low in cost, and is more suitable for the aluminum-copper soldering or aluminum-aluminum soldering than the prior solder.

Description

technical field [0001] The invention relates to a Sn-Zn-Bi-based lead-free solder alloy for aluminum-copper soldering, and belongs to the technical field of new materials. Background technique [0002] In recent years, due to the shortage of copper resources, copper prices have remained high. In order to reduce costs, aluminum, which has electrical conductivity and thermal conductivity closer to copper, has been used instead of copper in industries such as refrigeration, power transmission, machinery manufacturing, and electronics manufacturing. In the application of aluminum instead of copper, the problem of aluminum-copper dissimilar metal connection is particularly important. [0003] At present, the main method of aluminum-copper brazing is brazing (brazing temperature higher than 450°C), using aluminum-silicon-based solders, such as Al-12.6wt.%Si eutectic solder (eutectic temperature 577°C) and The solder of the third component is added, usually by vacuum heating or au...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 黄明亮侯宪林赵宁杨耀春张飞张同心
Owner DALIAN UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com