Laser boring method and device assisted by electric field and magnetic field coupling

Abstract

The invention provides a laser boring method assisted by electric field and magnetic field coupling. The laser boring method comprises the following steps that (1) a workpiece is clamped on a laser boring device assisted by electric field and magnetic field coupling; (2) a control circuit is used for controlling a rotating magnetic field generation unit and an electric field generation unit to generate a rotating magnetic field and a rotating electric field respectively, and the electric field direction is always perpendicular to the magnetic field direction; (3) a laser device is turned on, wherein laser beams generated by the laser device act on the surface of the workpiece through a focusing lens, air is blown to the surface of the workpiece at the same time, and then laser boring is conducted on the workpiece under the combined action of the rotating magnetic field, the rotating electric field, the laser beams and thermo-ionized gas. According to the laser boring method assisted by electric field and magnetic field coupling, based on the movement principle of charged particles in the magnetic field and self-inductance currents generated by the rotating magnetic field in a conductor, the movement of plasma and molten metal which are generated in the laser boring process is controlled, and therefore the purpose of optimizing the laser boring effect is achieved. In addition, the invention further provides the laser boring device assisted by electric field and magnetic field coupling.

Description

technical field [0001] The invention belongs to the field of laser processing, and in particular relates to a laser drilling method and device assisted by electric and magnetic field coupling. Background technique [0002] With the continuous development of micro-electromechanical technology (MEMS) and the miniaturization and lightweight design of traditional products, people's requirements for micro-hole processing technology are getting higher and higher. Traditional machining methods can no longer meet the processing requirements of micro-holes. , an urgent need for a new micro-hole processing technology. Laser drilling is one of the key technologies in the field of modern manufacturing technology. Compared with other drilling methods, laser drilling has a large depth-to-diameter ratio, no contact, no tool loss, fast processing speed, small surface deformation, and can process various It can well meet the requirements of modern industrial product processing and has been ...

AI Technical Summary

Problems solved by technology

However, the existing laser drilling method has the following disadvantages: 1. The plasma shielding effect is serious in the laser drilling process, which causes the loss of laser energy; 2. There is a recast layer with uneven thickness on the hole wall after processing, which affects the quality of the hole; 3. The impact force generated during the high-energy and long-pulse laser drilling process is too large, resulting in low repeatability of the processed holes, micro-cracks on the hole wall, and difficult to improve the quality of the holes.

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