Low-scratch diamond grinding fluid

A technology of grinding fluid and diamond, applied in the field of grinding fluid, can solve problems such as reducing the qualified rate of processed products, affecting the quality of processed objects, and scratching diamond grinding fluid, so as to reduce polishing procedures and working time, reduce processing costs, and improve removal rate constant effect

Inactive Publication Date: 2014-04-30
上海百兰朵电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] But, the commonly used diamond grinding liquid generally has obvious scratch phenomenon at present, discloses a kind of high suspending force water-soluble anti-rust grinding liquid as Chinese patent application document (publication number is CN1392179A, open date on January 22, 2003), It is composed of suspending agent, coagulant, rust inhibitor, lubricant, etc.
This kind of grinding liquid provides a gel-like water-based anti-rust grinding liquid with high suspending and dispersing ability for various abrasives of different compositions and particle sizes. Its outstanding disadvantage is that there are obvious scratches during use, which affects the The quality of the processed object reduces the qualified rate of processed products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1 , Preparation of a low-scratch diamond grinding fluid

[0023] (1) Selection of grinding liquid formula:

[0024]

[0025]

[0026] (2) Preparation method: put alkanes, dispersing thixotropic agent, surfactant, and lubricant into the mixer according to the above ratio and fully dissolve to obtain a fusion liquid, and then mix diamond particles with a particle size of 1 to 10 μm according to the above ratio Put the micropowder into the fusion liquid and stir, then disperse with ultrasound (500 watts) for 10 minutes to obtain a dispersion liquid, and finally add the above pH regulator to adjust the pH value of the dispersion liquid.

[0027] (3) Scratch detection: Use the above-mentioned prepared abrasive liquid as the polishing liquid to polish 5 pieces of 2-inch sapphire chips on a special polishing machine. The flow rate of the polishing fluid is 2mL / min, the polishing time is 10min, and the polishing rate is 1.8μm / min; after polishing, the surface ro...

Embodiment 2

[0028] Example 2 , Preparation of a low-scratch diamond grinding fluid

[0029] (1) Selection of grinding liquid formula:

[0030]

[0031] (2) Preparation method: put alkanes, dispersing thixotropic agent, surfactant, and lubricant into the mixer according to the above ratio and fully dissolve to obtain a fusion liquid, and then mix diamond particles with a particle size of 1 to 10 μm according to the above ratio Put the micropowder into the fusion liquid and stir, then disperse with ultrasound (500 watts) for 10 minutes to obtain a dispersion liquid, and finally add the above pH regulator to adjust the pH value of the dispersion liquid.

[0032] (3) Scratch detection: Use the above-mentioned prepared abrasive liquid as the polishing liquid to polish 5 pieces of 2-inch sapphire chips on a special polishing machine. The flow rate of the polishing fluid is 2mL / min, the polishing time is 10min, and the polishing rate is 1.8μm / min; after polishing, the surface roughness of ...

Embodiment 3

[0033] Example 3 , Preparation of a low-scratch diamond grinding fluid

[0034] (1) Selection of grinding liquid formula:

[0035]

[0036]

[0037] (2) Preparation method: put alkanes, dispersing thixotropic agent, surfactant, and lubricant into the mixer according to the above ratio and fully dissolve to obtain a fusion liquid, and then mix diamond particles with a particle size of 1 to 10 μm according to the above ratio Put the micropowder into the fusion liquid and stir, then disperse with ultrasound (500 watts) for 10 minutes to obtain a dispersion liquid, and finally add the above pH regulator to adjust the pH value of the dispersion liquid.

[0038] (3) Scratch detection: Use the above-mentioned prepared abrasive liquid as the polishing liquid to polish 5 pieces of 2-inch sapphire chips on a special polishing machine. The flow rate of the polishing fluid is 2mL / min, the polishing time is 10min, and the polishing rate is 1.8μm / min; after polishing, the surface r...

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Abstract

The invention provides low-scratch diamond grinding fluid. The low-scratch diamond grinding fluid is prepared by mixing the following components by weight percent: 78-83% of alkane, 1-5% of dispersing thixotropic agent, 9-11% of surfactant, 2-5% of lubricating agent, 2-5% of pH regulator and 0.1-1% of diamond micropowder. The low-scratch diamond grinding fluid has the beneficial effects that the low-scratch diamond grinding fluid can reduce scratches under the condition of the same grinding material grain size, effectively improve the roughness of a chip surface, reduce the product processing procedures and reduce the processing cost, and can be widely used for grinding and polishing LED (light emitting diode) chips, LED display screens, optical crystals, silicon wafers, compound crystals, liquid crystal display panels, gems, ceramics, germanium wafers, metal workpieces and the like.

Description

technical field [0001] The invention relates to a grinding fluid, in particular to a low-scratch diamond grinding fluid. Background technique [0002] In the process of semiconductor processing, the initial semiconductor substrate needs to be polished. The polishing process is usually carried out with abrasive liquid. The abrasive liquid is prepared by dispersing abrasive particles in the medium. It is a grinding product with excellent chemical and mechanical properties and can be used for silicon Grinding and polishing of chips, compound crystals, precision optical devices, liquid crystal panels, gemstones, metal workpieces, etc. Abrasive grains are the key factor for the mechanical action of the grinding fluid. Different types of abrasive grains with different particle sizes have different grinding effects and are suitable for different processing requirements. Generally speaking, the higher the abrasive hardness and the larger the particles, the higher the grinding effic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02
Inventor 朱孟奎
Owner 上海百兰朵电子科技有限公司
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